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參數(shù)資料
| 型號： | SIDC85D170H |
| 廠商： | INFINEON TECHNOLOGIES AG |
| 英文描述： | Fast switching diode chip in EMCON 3 -Technology |
| 中文描述： | 快速開關(guān)二極管芯片快恢復(fù)3技術(shù) |
| 文件頁數(shù)： | 1/4頁 |
| 文件大小： | 94K |
| 代理商： | SIDC85D170H |
Preliminary
SIDC85D170H
Edited by INFINEON Technologies AI PS DD HV3, L 4491A, Edition 1, 22.10.2001
Fast switching diode chip in EMCON 3 -Technology
This chip is used for:
EUPEC power modules
FEATURES:
1700V EMCON 3 technology 200 μm chip
soft, fast switching
low reverse recovery charge
small temperature coefficient
Applications:
resonant applications, drives
A
C
Chip Type
V
R
I
F
Die Size
Package
Ordering Code
Q67050-A4178-
A001
SIDC85D170H
1700V
150A
9.2 x 9.2 mm
2
sawn on foil
MECHANICAL PARAMETER:
Raster size
9.2 x 9.2
Area total / active
84.64 / 67.8
Anode pad size
7.18 x 7.18
mm
2
Thickness
200
μm
Wafer size
150
mm
Flat position
180
deg
Max. possible chips per wafer
160 pcs
Passivation frontside
Photoimide
Anode metallization
3200 nm Al Si 1%
Cathode metallization
Ni Ag –system
suitable for epoxy and soft solder die bonding
Die bond
electrically conductive glue or solder
Wire bond
Al,
≤
500μm
Reject Ink Dot Size
0.65mm; max 1.2mm
Recommended Storage Environment
store in original container, in dry nitrogen,
< 6 month
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