參數(shù)資料
型號(hào): SI5110-H-BL
廠商: Silicon Laboratories Inc
文件頁數(shù): 28/36頁
文件大?。?/td> 0K
描述: IC TXRX SONET/SDH LP HS 99-PBGA
標(biāo)準(zhǔn)包裝: 168
系列: SiPHY™
類型: 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù): 1/1
規(guī)程: SONET/SDH
電源電壓: 1.71 V ~ 1.89 V
安裝類型: 表面貼裝
封裝/外殼: 99-LBGA
供應(yīng)商設(shè)備封裝: 99-BGA(11x11)
包裝: 托盤
Si5110
34
Rev. 1.5
20. 11x11 mm 99L PBGA Recommended PCB Layout
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to
be 60 m minimum, all the way around the pad.
Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder
paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components.
Symbol
Min
Nom
Max
X
0.40
0.45
0.50
C1
9.00
C2
9.00
E1
1.00
E2
1.00
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