參數(shù)資料
型號: SI3225DC0-EVB
廠商: Silicon Laboratories Inc
文件頁數(shù): 9/112頁
文件大?。?/td> 0K
描述: DAUGHTER CARD W/SI3200 INTERFACE
標(biāo)準(zhǔn)包裝: 1
系列: ProSLIC®
主要目的: 接口,模擬前端(AFE)
已用 IC / 零件: Si3225
已供物品: 板,CD
Si3220/25 Si3200/02
106
Rev. 1.3
Not
Recommended
fo
r N
ew
D
esi
gn
s
12
IRINGN
I
Negative RING Current Control.
Connect to the IRINGN lead of the Si3220 or Si3225.
13
IRINGP
I
Positive RING Current Drive.
Connect to the IRINGP lead of the Si3220 or Si3225.
14
THERM
O
Thermal Sensor.
Connect to THERM pin of Si3220 or Si3225.
15
ITIPN
I
Negative TIP Current Control.
Connect to the ITIPN lead of the Si3220 or Si3225.
16
ITIPP
I
Positive TIP Current Control.
Connect to the ITIPP lead of the Si3220 or Si3225.
epad
GND
Exposed Die Paddle Ground.
For adequate thermal management, the exposed die paddle should be sol-
dered to a PCB pad that is connected to low-impedance inner and/or back-
side ground planes using multiple vias. See “7. Package Outline: 16-Pin
ESOIC” for PCB pad dimensions.
Pin #(s)
Symbol
Input/
Output
Description
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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