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參數(shù)資料
| 型號： | SI2439-A-GM |
| 廠商： | Silicon Laboratories Inc |
| 文件頁數(shù)： | 65/70頁 |
| 文件大小： | 0K |
| 描述： | IC ISOMODEM 33.6KBPS 38-QFN |
| 標(biāo)準(zhǔn)包裝： | 364 |
| 系列： | * |
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Si2494/39
68
Rev. 1.0
14. 16-Pin SOIC Land Pattern
Figure 19 illustrates the recommended land pattern for the Si2494/39 16-Pin SOIC. Table 21 lists the values for the
dimensions shown in the illustration.
Figure 19. 16-Pin SOIC Land Pattern Diagram
Table 21. 16-Pin SOIC Land Pattern Dimensions
Dimension
Feature
(mm)
C1
Pad Column Spacing
5.40
E
Pad Row Pitch
1.27
X1
Pad Width
0.60
Y1
Pad Length
1.55
Notes:
General
1.
All dimensions shown are in millimeters (mm) unless otherwise noted.
2.
Dimensioning and Tolerancing per ASME Y14.5M-1994.
3.
This Land Pattern Design is based on the IPC-7351 guidelines.
4.
All dimensions shown are at Maximum Material Condition (MMC). Least Material
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
Solder Mask Design
5.
All metal pads are to be non-solder mask defined (NSMD). Clearance between the
solder mask and the metal pad is to be 60 m minimum, all the way around the pad.
Stencil Design
6.
A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should
be used to assure good solder paste release.
7.
The stencil thickness should be 0.125 mm (5 mils).
8.
The ratio of stencil aperture to land pad size should be 1:1.
Card Assembly
9.
A No-Clean, Type-3 solder paste is recommended.
10.
The recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for Small Body Components.
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| SI2439-A-GMR | 制造商:Silicon Laboratories Inc 功能描述:33.6 KBPS ISOMODEM + VOICE - Tape and Reel 制造商:Silicon Laboratories Inc 功能描述:IC ISOMODEM 33.6KBPS 38-QFN |
| SI2456 | 制造商:SILABS 制造商全稱:SILABS 功能描述:V.90, V.34, V.32BIS ISOMODEM⑩ WITH INTEGRATED GLOBAL DAA |
| SI2456-FT | 制造商:Silicon Laboratories Inc 功能描述:MODEM CHIP CHIPSET ISOMODEM 56KBPS 24TSSOP - Rail/Tube |
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