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參數(shù)資料
| 型號： | SHF-0589 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | 0.05-3 GHz, 2 Watt GaAs HFET |
| 中文描述： | 0.05-3千兆赫，2瓦特砷化鎵異質(zhì)結(jié)場效應(yīng)晶體管 |
| 文件頁數(shù)： | 4/4頁 |
| 文件大?。?/td> | 195K |
| 代理商： | SHF-0589 |
SHF-0589 2 Watt HFET
4
EDS-101242 Rev F
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
http://www.sirenza.com
Caution: ESD sensitive
testing devices must be observed.
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The part will be symbolized with the “H5”
designator and a dot signifying pin 1 on the top
surface of the package.
Part Symbolization
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Pin Description
Mounting and Thermal Considerations
It is very important that adequate heat sinking be
provided to minimize the device junction
temperature. The following items should be
implemented to maximize MTTF and RF
performance.
1. Multiple solder-filled vias are required directly
below the ground tab (pin 4). [CRITICAL]
2. Incorporate a large ground pad area with
multiple plated-through vias around pin 4 of the
device. [CRITICAL]
3. Use two point board seating to lower the thermal
resistance between the PCB and mounting plate.
Place machine screws as close to the ground tab
(pin 4) as possible. [CRITICAL]
4. Use 2 ounce copper to improve the PCB’s heat
spreading capability. [CRITICAL]
5. Thermal transfer paste should be used between
the PCB and the mounting plate to improve heat
spreading capability. [RECOMMENDED]
Recommended Mounting Configuration for
Optimum RF and Thermal Performance
SHF-0x89
Machine
Screws
Plated Thru
Holes
(0.020" DIA)
Ground Plane
H
.016
.118
.019
.096
.041
.177.068
.059
.015
.161
4
3
2
1
DIMENSIONS ARE IN INCHES
Package Dimensions
NOTRECOMMENDEDFORNEWDESGN
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