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參數(shù)資料
| 型號(hào)： | SG7905L/883B |
| 廠商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分類(lèi)： | 固定負(fù)電壓?jiǎn)温份敵鰳?biāo)準(zhǔn)穩(wěn)壓器 |
| 英文描述： | Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT06; Number of Contacts:3; Connector Shell Size:8; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight |
| 中文描述： | 5 V FIXED NEGATIVE REGULATOR, CQCC20 |
| 封裝： | CERAMIC, LCC-20 |
| 文件頁(yè)數(shù)： | 2/7頁(yè) |
| 文件大小： | 162K |
| 代理商： | SG7905L/883B |
SG7900A/SG7900 SERIES
12/91 Rev 1.4 12/99
LINFINITY Microelectronics Inc.
Copyright
1999
11861 Western Avenue ∞
∞
∞ Garden Grove, CA 92841
2
(714) 898-8121 ∞
∞
∞FAX: (714) 893-2570
ABSOLUTE MAXIMUM RATINGS (Note 1)
NEGATIVE REGULATOR
Device
Input Voltage Differential
Output Voltage
Input Voltage
(Output shorted to ground)
-5V
-35V
35V
-12V
-35V
35V
-15V
-40V
35V
150
°C
-65
°C to 150°C
300
°C
Operating Junction Temperature
Hermetic (K, T, IG & L - Packages) ........................
Storage Temperature Range ..........................
Lead Temperature (Soldering, 10 Seconds) .................
Note 1. Values beyond which damage may occur.
THERMAL DATA
K Package:
Thermal Resistance-Junction to Case,
θ
JC .................
3.0°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ............... 35°C/W
T Package:
Thermal Resistance-Junction to Case,
θ
JC ..................
15°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ............
120°C/W
IG Package:
Thermal Resistance-Junction to Case,
θ
JC .................
3.5°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ..............
42°C/W
L Package:
Thermal Resistance-Junction to Case,
θ
JC ..................
35°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ............
120°C/W
Note A. Junction Temperature Calculation: T
J = TA + (PD x θJA).
Note B. The above numbers for
θ
JC are maximums for the limiting thermal
resistance of the package in a standard mounting configuration.
The
θ
JA numbers are meant to be guidelines for the thermal
performance of the device/pc-board system. All of the above
assume no ambient airflow.
FIGURE 1.
MAXIMUM AVERAGE POWER DISSIPATION
FIGURE 2.
QUIESCENT CURRENT VS. LOAD
FIGURE 3.
TEMPERATURE COEFFICIENT
Note 2. Range over which the device is functional.
CHARACTERISTIC CURVES
-55
°C to 150°C
Operating Junction Temperature Range:
SG7900A/7900 .............................................
RECOMMENDED OPERATING CONDITIONS (Note 2)
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