
SG1635/SG3635
Rev 1.1a
Copyright
1994
11861 Western Avenue
∞
∞ Garden Grove, CA 92841
2
(714) 898-8121
∞
∞ FAX: (714) 893-2570
ABSOLUTE MAXIMUM RATINGS (Note 1)
Supply Voltage (V
S)
SG1635/SG3635 ............................................................. 40V
Input Voltage
Enable and Pulse .............................................................. 7V
Source/Sink Output Current
Contiuous ........................................................................... 3A
Peak ................................................................................... 5A
Operating Junction Temperature
Hermetic (R - Package) ............................................... 150°C
Plastic (P - Package) ................................................... 150°C
Storage Temperature Range ............................ -65°C to 150°C
Lead Temperature (Soldering, 10 Seconds) .................. 300°C
Supply Voltage (V
S)
SG1635/SG3635 .................................................... 8V to 35V
Source/Sink Output Current
Continuous ......................................................................... 2A
Peak ................................................................................... 3A
Operating Ambient Temperature Range
SG1635 ........................................................... -55°C to 125°C
SG3635 ................................................................ 0°C to 70°C
Note 2. Range over which the device is functiona
l.
RECOMMENDED OPERATING CONDITIONS (Note 2)
ELECTRICAL CHARACTERISTICS
SG1635/SG3635
Parameter
Test Conditions
SG1635 and SG3635
(Unless otherwise specified, these specfiications apply over the operating ambient temperatures for SG1635 with -55
°C ≤ T
A ≤ 125°C, SG3635 with
0
°C ≤ T
A ≤ 70°C, and +VS = 24V. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient
temperature.)
V
PULSE = VENABLE = 4.5V
V
PULSE = VENABLE = 0V
V
PULSE = VENABLE = 2.0V
V
OUT = 24V
V
OUT = 0V
V
PULSE = 2.0V, VENABLE = 0.8V, IOUT = -2A
V
PULSE = 0.8V, VENABLE = 2.0V, IOUT = 2A
I
DIODE = ±2A
V
S = 35V
V
PULSE = 2.0V, VENABLE = 0.8V
V
PULSE = 0.8V, VENABLE = 2.0V
Logic 1 Input Voltage
Logic 0 Input Voltage
Input High Current
Input Low Current
Output Leakage
Source Saturation Voltage
Sink Saturation Voltage
Diode Forward Voltage
Supply Current
Static Characteristics
2.0
V
A
mA
V
mA
2.0
Min.
Typ. Max.
Units
0.8
200
-3.2
500
40
3.0
25
70
Note 1. Values beyond which damage may occur.
* =
θθθθθ
JT (Junction to Tab)
THERMAL DATA
R Package:
Thermal Resistance-Junction to Case,
θ
JC .................
5.0°C/W
Thermal Resistance-Junction to Ambient,
θ
JA .............. 40°C/W
P Package:
Thermal Resistance-Junction to Case,
θ
JT ................ 4.0°C/W*
Thermal Resistance-Junction to Ambient,
θ
JA .............
55°C/W
Note A. Junction Temperature Calculation: T
J = TA + (PD x θJA).
Note B. The above numbers for
θ
JC are maximums for the limiting
thermal resistance of the package in a standard mount-
ing configuration. The
θ
JA numbers are meant to be
guidelines for the thermal performance of the device/pc-
board system. All of the above assume no ambient
airflow.
RoHS Peak Package Solder Reflow Temp. (40 sec. max. exp.)...... 260°C (+0, -5)
O
B
SO
LETE
PRO
D
UCT
NOT
RECOMMENDED
FOR
NEW
DESIGNS