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參數(shù)資料
| 型號(hào)： | SG1825C |
| 廠商： | Microsemi Corporation |
| 英文描述： | HIGH - SPEED CURRENT - MODE PWM |
| 中文描述： | 高-高速電流-模式PWM |
| 文件頁(yè)數(shù)： | 2/7頁(yè) |
| 文件大小： | 184K |
| 代理商： | SG1825C |
H
I G H
- S
P E E D
C
U R R E N T
-M
O D E
PWM
N
O T
R
E C O M M E N D E D
F O R
N
E W
D
E S I G N S
SG1825C/SG2825C/SG3825C
P R O D U C T D A T A B O O K 1 9 9 6 / 1 9 9 7
Copyright 1994
Rev. 1.3 6/96
2
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Input Voltage (V
IN
and V
C
).......................................................................................... 30V
Analog Inputs:
Error Amplifier and Ramp ........................................................................-0.3V to 7.0V
Softstart and I
/S.D. ................................................................................-0.3V to 6.0V
Digital Input (Clock) ....................................................................................1.5V to 6.0V
Driver Outputs ........................................................................................-0.3V to V
C
+1.5V
Source / Sink Output Current (each output):
Continuous .............................................................................................................. 0.5A
Pulse, 500ns ............................................................................................................ 2.0A
Softstart Sink Current................................................................................................ 20mA
Clock Output Current................................................................................................. 5mA
Error Amplifier Output Current ................................................................................. 5mA
Oscillator Charging Current ....................................................................................... 5mA
Operating Junction Temperature:
Hermetic (J, L Package) ....................................................................................... 150°C
Plastic (DW, N, Q Packages) ............................................................................... 150°C
Storage Temperature Range......................................................................-65°C to 150°C
Lead Temperature (soldering, 10 seconds) ............................................................ 300°C
PACKAGE PIN OUTS
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
J & N PACKAGE
(Top View)
4
5
6
7
8
3
2
1
9
11 12
13
10
14
15
16
17
18
20 19
DW PACKAGE
(Top View)
Note 1. Exceeding these ratings could cause damage to the device.
N PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
DW PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
Q PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
J PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
L PACKAGE:
THERMAL RESISTANCE-JUNCTION TO CASE,
θ
JC
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
65°C/W
95°C/W
80°C/W
80°C/W
35°C/W
120°C/W
Junction Temperature Calculation: T
= T
+ (P
x
θ
).
The
θ
numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
THERMAL DATA
INV. INPUT
N.I. INPUT
E/A OUTPUT
CLOCK
R
T
C
T
RAMP
SOFTSTART
V
REF
+V
IN
OUTPUT B
V
C
PWR GND
OUTPUT A
GROUND
I
LIM
/ S.D.
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
+V
REF
+V
IN
OUTPUT B
V
C
PWR GND
OUTPUT A
GROUND
I
LIM
/ S.D.
INV. INPUT
N.I. INPUT
E/A OUTPUT
CLOCK
R
T
C
T
RAMP
SOFTSTART
11. N.C.
12. I
/ S.D.
13. GROUND
14. OUTPUT A
15. PWR GND
16. N.C.
17. V
18. OUTPUT B
19. +V
IN
20. V
REF
1. N.C.
2. INV. INPUT
3. N.I. INPUT
4. E/A OUTPUT
5. CLOCK
6. N.C.
7. R
T
8. C
9. RAMP
10. SOFTSTART
L PACKAGE
(Top View)
Q PACKAGE
(Top View)
3
2
1
20 19
4
18
17
5
6
16
15
7
8
14
9
11 12 13
10
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