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參數(shù)資料
| 型號： | SG1540Y/883B |
| 廠商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | OFF-LINE START-UP CONTROLLER |
| 中文描述： | 0.2 A SWITCHING CONTROLLER, 400 kHz SWITCHING FREQ-MAX, CDIP8 |
| 封裝： | HERMETIC SEALED, CERAMIC, DIP-8 |
| 文件頁數(shù)： | 2/6頁 |
| 文件大?。?/td> | 98K |
| 代理商： | SG1540Y/883B |
Rev 1.1a
Copyright
1994
11861 Western Avenue
∞
∞ Garden Grove, CA 92841
2
(714) 898-8121
∞
∞ FAX: (714) 893-2570
SG1540/SG2540/SG3540
Overvoltage Crowbar Energy (CV) ................................. 8mJ
Operating Junction Temperature
Hermetic (Y Package) ................................................ 150°C
Plastic (M, DW Packages) .......................................... 150°C
Storage Temperature Range ............................ -65°C to 150°C
Lead Temperature (Soldering, 10 Seconds) .................. 300°C
Supply Voltage (+V
IN ) ........................................................ +37V
DC Output Current, Continuous (V
OUT) ........................... 100mA
AC Output Current, Continuous ..................................... 200mA
Analog Inputs (Start and Overvoltage) ................. -0.3V to 6.0V
Analog Input Currents (V>8V) .......................................... 10mA
Overvoltage Crowbar Current, Continuous ..................... 50mA
Note 1. Values beyond which damage may occur.
ABSOLUTE MAXIMUM RATINGS (Note 1)
Y Package:
Thermal Resistance-Junction to Case,
θ
JC ..................
50°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ............ 130°C/W
M Package:
Thermal Resistance-Junction to Case,
θ
JC ..................
60°C/W
Thermal Resistance-Junction to Ambient,
θ
JA .............
95°C/W
DW Package:
Thermal Resistance-Junction to Case,
θ
JC ..................
40°C/W
Thermal Resistance-Junction to Ambient,
θ
JA .............
95°C/W
THERMAL DATA
Note A. Junction Temperature Calculation: T
J
= T
A
+ (P
D
x
θ
JA
).
Note B. The above numbers for
θ
JC are maximums for the limiting
thermal resistance of the package in a standard mount-
ing configuration. The
θ
JA numbers are meant to be
guidelines for the thermal performance of the device/pc-
board system. All of the above assume no ambient
airflow.
Timing Capacitor Range ........................................ 1nF to 20F
Operating Ambient Temperature Range
SG1540 ........................................................... -55°C to 125°C
SG2540 ............................................................. -25°C to 85°C
SG3540 ................................................................ 0°C to 70°C
Supply Voltage Range ............................................... 7V to 35V
DC Output Current, Continuous ................................ 0 to 50mA
AC Output Current, Continuous ............................. 0 to 100 mA
Oscillator Frequency Range ........................... 1KHz to 400KHz
Timing Resistor Range ...................................... 2K
to 150K
Note 2. Range over which the device is functiona
l.
RECOMMENDED OPERATING CONDITIONS (Note 2)
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG1540 with -55
°C ≤ T
A ≤ 125°C,
SG2540 with
-25
°C ≤ T
A ≤ 85°C, SG3540 with 0 °C ≤ TA ≤ 70°C, and +VIN = 15V. A 0.1F high frequency bypass capacitor is recommended on V IN. Low duty cycle
testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.)
Units
Typ. Max.
V
START = 0 to 2.37V
V
TIMING = +VIN ;
V
OUT Open
F
OSC = 50KHz, VOUT and AC OUT Open
V
PIN 1 = 0 to 5V
I
PIN 1 = 1mA
I
PIN 4 = 100A
2.37
6
0.2
0.3
3
2.50
0.1
7
0.1
0.4
0.6
6
2.63
1
8
0.2
mA
V
A
V
Start-up Section
Start Current I
CC
Operating Current
Start Threshold
Start Bias Current
Start Clamp Voltage
Hysteresis ON Voltage
DC Output Section
Min.
SG1540/2540/3540
Test Conditions
Parameter
V
OUT Voltage
Short Circuit Current
12.5
12.0
50
13.5
13.0
100
225
V
mA
I
SOURCE = 10mA
I
SOURCE = 50mA
V
OUT = 0V
RoHS Peak Package Solder Reflow Temp (40 sec. max. exp.)...... 260°C (+0, -5)
O
B
SO
LETE
PRO
D
UCT
NOT
RECOMMENDED
FOR
NEW
DESIGNS
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