
SG120
11/91 Rev 1.4 6/97
LINFINITY
Microelectronics
Inc.
Copyright
1997
11861
Western
Avenue
∞
Garden
Grove,
CA
92841
2
(714) 898-8121
∞
FAX: (714) 893-2570
ABSOLUTE MAXIMUM RATINGS (Note 1)
NEGATIVE REGULATOR
-65
°C to 150°C
300
°C
Operating Junction Temperature
Hermetic (K, R, IG - Packages) ...................................
Storage Temperature Range ...........................
Lead Temperature (Soldering, 10 Seconds) .................
FIGURE 1.
MAXIMUM AVERAGE POWER DISSIPATION
FIGURE 2.
QUIESCENT CURRENT VS. LOAD
FIGURE 3.
TEMPERATURE COEFFICIENT
Device
Input Voltage Differential
Output Voltage
Input Voltage
(Output shorted to ground)
-5V
-35V
35V
-5.2V
-35V
35V
-8V
-35V
35V
-12V
-35V
35V
-15V
-40V
35V
-18V
-40V
35V
-20V
-40V
35V
150
°C
Note 1. Values beyond which damage may occur.
Operating Junction Temperature Range:
SG120 ...........................................................
RECOMMENDED OPERATING CONDITIONS (Note 2)
CHARACTERISTIC CURVES
-55
°C to 150°C
Note 2. Range over which the device is functional.
THERMAL DATA
K Package:
Thermal Resistance-Junction to Case,
θ
JC .................
3.0°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ............... 35°C/W
R Package:
Thermal Resistance-Junction to Case,
θ
JC .................
5.0°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ..............
40°C/W
T Package:
Thermal Resistance-Junction to Case,
θ
JC ..................
15°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ............
120°C/W
IG Package:
Thermal Resistance-Junction to Case,
θ
JC .................
3.5°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ..............
42°C/W
L Package:
Thermal Resistance-Junction to Case,
θ
JC ..................
35°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ............
120°C/W
Note A. Junction Temperature Calculation: T
J = TA + (PD x θJA).
Note B. The above numbers for
θ
JC are maximums for the limiting thermal
resistance of the package in a standard mounting configuration.
The
θ
JA numbers are meant to be guidelines for the thermal
performance of the device/pc-board system. All of the above
assume no ambient airflow.