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參數(shù)資料
| 型號(hào)： | SFC3.3-4.TK |
| 元件分類： | TVS二極管 - 瞬態(tài)電壓抑制 |
| 英文描述： | 150 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE, MO-211BB |
| 封裝： | MO-221BB, FLIP CHIP, CSP-6 |
| 文件頁(yè)數(shù)： | 4/7頁(yè) |
| 文件大?。?/td> | 116K |
| 代理商： | SFC3.3-4.TK |
4
2003 Semtech Corp.
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
SFC3.3-4
Device Schematic and Pin Configuration
Layout Example
NSMD Package Footprint
Device Connection Options
The SFC3.3-4 has solder bumps located in a 3 x 2
matrix layout on the active side of the device. The
bumps are designated by the numbers 1 - 3 along the
horizontal axis and letters A - B along the vertical axis.
The lines to be protected are connected at bumps A1,
B1, A3, and B3. Bumps A2 and B2 are connected to
ground. All path lengths should be kept as short as
possible to minimize the effects of parasitic inductance
in the board traces.
Wafer Level CSP TVS
CSP TVS devices are wafer level chip scale packages.
They eliminate external plastic packages and leads and
thus result in a significant board space savings. Manu-
facturing costs are minimized since they do not require
an intermediate level interconnect or interposer layer
for reliable operation. They are compatible with cur-
rent pick and place equipment further reducing manu-
facturing costs. Certain precautions and design
considerations have to be observed however for
maximum solder joint reliability. These include solder
pad definition, board finish, and assembly parameters.
Printed Circuit Board Mounting
Non-solder mask defined (NSMD) land patterns are
recommended for mounting the SFC3.3-4. Solder
mask defined (SMD) pads produce stress points near
the solder mask on the PCB side that can result in
solder joint cracking when exposed to extreme fatigue
conditions. The recommended pad size is 0.225 ±
0.010 mm with a solder mask opening of 0.350 ±
0.025 mm.
Printed Circuit Board Finish
A uniform board finish is critical for good assembly
yield. Two finishes that provide uniform surface coat-
ings are immersion nickel gold and organic surface
protectant (OSP). A non-uniform finish such as hot air
solder leveling (HASL) can lead to mounting problems
and should be avoided.
To Protected IC
To Connector
Ground
Applications Information
6
54
12
3
A
B
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