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參數(shù)資料
| 型號(hào)： | SF1091A |
| 廠商： | RF Monolithics, Inc. |
| 英文描述： | 211 MHz SAW Filter |
| 中文描述： | 211兆赫SAW濾波器 |
| 文件頁(yè)數(shù)： | 9/9頁(yè) |
| 文件大?。?/td> | 238K |
| 代理商： | SF1091A |
211 MHz SAW Filter
RF Monolithics, Inc.
RFM Europe
1999 by RF Monolithics, Inc. The stylized RFM logo are registered trademarks of RF Monolithics, Inc.
Phone: (972) 233-2903
Phone: 44 1963 251383
Fax: (972) 387-8148
Fax: 44 1963 251510
E-mail: info@rfm.com
http://www.rfm.com
SF1091A-100605
Page 9 of 9
RFM Qualification and Reliability Test
Standard
MIL-STD-202
Method 108
Condition C
Test
Test Parameters
1,000 Hours
125°C
Unbiased
Pass / Fail Criteria
1
Life at
Elevated
Temperature
Within
Electrical &
Hermetic Spec.
(Note 1)
2
Temperature
Cycling
JESD22
Method JA-104
Air-to-Air
-55 ×Cto +125 ×C
20 min. Dwell
1,000 cycles
3
Vibration,
Variable
Frequency
MIL-STD-883
Method 2007
Condition B
50g Max.
4 Cycles, 3 Axis
20 Hz to 2 kHz to
20 Hz
4
Mechanical
Shock
MIL-STD-883
Method 2002
Condition B
1,500g Max.
5 Shocks
±
3 Axis
5
Destructive
Bond
Strength
MIL-STD-883
Method 2011
Condition C
Wire Bond Pull
Strength
2.0 grams
(After Seal)
6
Die Shear
Strength
MIL-STD-883
Method 2019
Shear Strength
0.6 kg
(Strength/area
limit in
development)
7
Solderability
(Note 2)
J-STD-002
Method B
8 hr. steam age
245 × C solder
temperature
5 second dwell
>95% wetted
surface
8
Physical
Dimensions
Temperature
Characteristics
JESD22
Method JB-100
Critical
Dimensions
Frequency over
Temperature
Within
specifications
9
RFM Procedure
Within
specifications
10
Terminal
Strength
(Note 2)
MIL-STD-833
Method 2004
Condition A & D
Cond. A-Lead
Tension
Cond. B -Pad
Adhesionr 24
8 oz. - 30 sec.
Visual Requirements
& meets
Hermetic Spec.
Visual
Requirements
Within
Electrical &
Hermetic Spec.
(Note 1)
11
Resistance to
Solvents
MIL-STD-883
Method 2015
Solvents a, b, d
12
Steady State
Life
MIL-STD-883
Method 1005
1,000 Hours
Max. Operating
Temperature
Rated Voltage
13
Internal Water-
Vapor Content
MIL-STD-883
Method 1018
< 5,001 PPM
14
Constant
Acceleration
MIL-STD-883
Method 2001
Y1 Direction
30,000g
Within
Electrical &
Hermetic Spec.
(Note 1)
15
Substrate
Attach Strength
MIL-STD-883
Method 2027
Tensile Strength of
Die Attachment
Custom per Device
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