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*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
SDM Series Surface Mount DIP Switch
Features
■
Double contacts
■
Low contact resistance
■
Self-clean on contact area
■
Vapor phase solderable, IR-reflow solderable
■
Terminal plating by gold gives excellent
results when soldering
■
RoHS compliant*
Electrical Characteristics
Electrical Life ............2,000 operations min.
per switch, 24 VDC, 25 mA
Non-Switching Rating ......100 mA, 50 VDC
Switching Rating ................25 mA, 24 VDC
Contact Resistance (@ current 100mA)
........................50 milliohms max. at initial
100 milliohms max. after life test
Insulation Resistance
........100 megohms min. at 500 ±15 VDC
Dielectric Strength ............500 VDC/minute
Capacitance..................5 pF max. between
adjacent closed switch
Circuit ....................Single pole single throw
Environmental Characteristics
Mechanical Life..2,000 operations per switch
Operation Force......................1000 gf max.
Stroke ..............................................1.0 mm
Operating Temp. Range....-20 °C to +70 °C
Storage Temperature........-40 °C to +85 °C
Vibration Test......................MIL-STD-202F,
Method 201A
Frequency ..............10-55-10 Hz/1 minute
Directions ................X,Y,Z, three mutually
perpendicular directions
Time......................2 hours each direction.
High reliability
Shock Test ..........................MIL-STD-202F,
Method 213B, Condition A
Gravity ..........50 G (peak value), 11 msec
Direction & Times....................6 sides and
3 times in each direction.
High reliability
Physical Characteristics
Base and Cover Materials
..UL94V-0 PPS plus glass fiber reinforced
Color ................................................Black
Actuator Materials ..............................Nylon
plus glass fiber reinforced
Color ................................................White
Contact Materials ....................Alloy copper
Terminal Materials ..............................Brass
Contact Plating Materials ....3 micro inches
gold plating over 40 micro inches nickel
Terminal Plating Materials....................Gold
Soldering Process ............Vapor phase and
IR-reflow soldering can be applied
Standard Packaging
......IC tubes/all poles in the “off” position
How to Order
SDM R - 2 - T R
Model
Actuator
X = Raised Actuator
R = Recessed Actuator
Number of Positions
1 = 1 Position
2 = 2 Positions
3 = 3 Positions
4 = 4 Positions
5 = 5 Positions
6 = 6 Positions
7 = 7 Positions
8 = 8 Positions
9 = 9 Positions
10 = 10 Positions
12 = 12 Positions
Seal
X = Standard (Not Sealed)
T = Top Tape Sealed (“R” Actuator only)
Packaging Option
(Top Sealed, Recessed only)
R = Tape and Reel Packaging
(900 pcs./reel)
B
±
0.10=2.54X(P-1)
(B
±
.004=.10X(P-1))
SDM Series
A + 0.2 / - 0
(A + .008/-0)
0.50
(.020)
2.0
(.079)
6.20 + 0.2 / -0
(.244 = .008/-0)
B
1.74
(.069)
2.54
(.100)
TYP.
3.0 + 0.10 / -0
(.118 + .004/-0)
0.70
7.62
±
0.25
(.300
±
.010)
0
°
~4
°
9.80
±
0.3
(.386
±
.012)
0.7
±
0.2
(.028
±
.088)
SDMR SERIES
1.0
(.039)
0.70
(.028)
RECOMMENDED PCB LAYOUT
SDMX SERIES
7.40
(.291)
10.4
(.409)
2.54
(.100)
TYP.
1.1
(.043)
MODEL NO.
SDM-12
SDM-10
SDM-8
SDM-6
SDM-4
SDM-2
POSITIONS
12
10
8
6
4
2
DIM. A
31.42
26.34
21.26
16.18
11.10
6.02
DIM. B
27.94
22.86
17.78
12.70
7.62
2.54
SCHEMATIC (TYP.)
1,2,3,4,5,6,7,8,9,10,12 POSITIONS AVAILABLE
2.00
±
(.079
±
0.25
DIA.
2.00
±
0.15
(.079
±
.006)
1.55
±
0.05
(.061
±
.002)
16.00
0.1
(.630
±
.004)
4.00
±
0.1
(.157
±
.004)
POLE
2,3
4,5,6
7,8
9,10,12
TAPE SIZE (W)
16 mm
24 mm
32 mm
44 mm
Packaging Specifications
Product Dimensions
DIMENSIONS: (IN)
Reflow Soldering Profile
T
°
C
Time (Seconds)
275
30-40 Sec.
120
°
C
225
175
125
75
250
20
40
60
80
100 120 140 160 180 200
80-90 Sec.
Sec.
Sec.
180
°
C
240
°
C
REV. 02/06
*RHSCOMPIAN
The SDM Series is currently available,
although not recommended for new
designs.