
9
Data Device Corporation
www.ddc-web.com
SD-14620
J-04/03-0
0.780 MAX
(19.81)
0.400
(10.16)
1.300 (33.02)
INDEX
DENOTES
PIN 1
0.210 MAX (5.33)
1.500 MAX
(36.75)
1.200 (30.48)
0.160 MIN
(4.06)
0.050
(1.27)
0.100 TYP (2.54)
0.050 TYP (1.27)
0.600
(15.24)
0.018
DIA TYP
(0.46)
26
27
28
29
53
54
2
1
3
52
30
25
NUMBERS FOR
REFERENCE ONLY
0.008
(0.20)
0.05
(1.27)
BOTTOM VIEW
SIDE VIEW
Notes:
1. Dimensions are in inches (mm).
2. Lead identification numbers are for reference only
3. Lead cluster shall be centered within ±0.005 (0.13) of outline dimensions.
Lead spacing dimensions apply only at seating plane.
4. Pin material meets solderability requirements to MIL-STD-202E, Method 208C.
5. Case is hermetically sealed ceramic package.
FIGURE 7. SD-14620 DIP MECHANICAL OUTLINE
26 EQ. SP. @
0.050 = 1.30
TOL NONCOM TYP
(1.24 = 33.02)
SEE NOTE 2
0.500 MIN TYP
(12.7)
0.100 ±0.010 TYP
(2.54 ±0.25)
0.210 MAX (5.33)
28
27
54
1
0.780 MAX
(19.81)
PIN 1 DENOTED BY
INDEX MARK
1.500 MAX
(38.1)
0.010 ±0.002 TYP
(0.25 ±0.05)
PIN NUMBERS FOR
REFERENCE ONLY
0.018 ±0.002 TYP
(0.46 ±0.05)
0.050 TYP
(1.27)
0.020 R TYP
(0.51)
BOTTOM VIEW
SIDE VIEW
Notes:
1. Dimensions are in inches (mm).
2. Lead cluster shall be centralized about case centerline within ±0.010 (±0.254).
FIGURE 8. SD-14620 FLAT PACK MECHANICAL OUTLINE