
2
SCI7661C
OA
/M
OA
I
PIN CONFIGURATION
I
PIN DESCRIPTION
I
ELECTRICAL CHARACTERISTICS
I
ABSOLUTE MAXIMUM RATINGS
CAP1+
CAP2+
CAP2-
CAP1-
TC1
TC2
V
IN
1
3
4
2
5
6
7
V
DD
OSC1
P
off
RV
V
reg
V
out
OSC2
14
11
9
8
13
12
10
The same pin configuration in
DIP and SOP
CAP1+, CAP1-
CAP2+, CAP2-
TC1, TC2
V
IN
V
OUT
Vreg
R
V
P
off
OSC2, OSC1
V
DD
1, 2
3, 4
5, 6
7
8
9
10
11
12, 13
14
Pin name
No.
Function
Terminal for connection of capacitor for doubler
Terminal for connection of capacitor for tripler
Temperature gradient selection terminal
Power supply terminal(negative, system supply
GND)
Output terminal at tripling
Regulated voltage output terminal
Regulated voltage control terminal
Vreg output ON/OFF control terminal
Oscillation resistor connection terminal
Power supply terminal(positive system supply
VCC)
Characteristic
Symbol
Condition
Min.
Typ.
Max.
Unit
(V
DD
= 0V, V
IN
=-5V, Ta=-30 to 85
°
C)
V
reg
V
OUT
V
reg
R
L
=
∞
, R
RV
=1M
,
V
O
=-18V
R
L
=
∞
, R
OSC
=1M
R
L
=
∞
, R
RV
=1M
V
OUT
=-15V
TC2=TC1=V
OUT
, R
L
=
∞
R
OSC
=1M
I
OUT
=10mA
-18V<V
OUT
<-8V,
V
reg
=-8V, R
L
=
∞
, Ta=25
°
C
V
I
V
O
-6.0
-18.0
-1.2
V
V
V
OUT
Iopr
1
-18.0
60
50
20
150
-3.2
100
V
μ
A
-18
Vreg
-2.6
V
Iopr
2
12.0
μ
A
I
OUT
=5mA
95
Peff
%
0.2
%/V
I
Q
f
osc
R
OUT
16
90
2.0
24
200
μ
A
kHz
Input supply voltage
Output voltage
Regulator operating voltage
Booster current consumption
Regulator current
consumption
Stationary current
Oscillation frequency
Output impedance
Booster power conversion
efficiency
Regulated output voltage
fluctuation
V
I
Input terminal voltage
OSC1, P
off
TC1, TC2, RV
Plastic package
Rating
Symbol
Remark
N
=
2 : Doubler
N
=
3 : Tripler
V
V
V
Unit
0.5
0.5
Max.
V
IN
-0.5
V
OUT
-0.5
-20.0
V
O
P
d
T
opr
T
stg
T
sol
Output voltage
Allowable loss
Operating temperature
Storage temperature
Soldering temperature and time
Note: When this IC is soldered in the solder-reflow process, be sure to maintain the reflow furnace at the curve shown in "Fig.
1-5 Reflow Furnace Temperature Curve" of this DATA BOOK. And this IC can not be exposed to high temperature of
the solder dipping.
mW
°
C
°
C
-
300
85
150
-30
-55
260
°
C, 10s(at lead)
V
I
Input supply voltage
V
0.5
-20/N
Min.
(V
DD
=0V)