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參數(shù)資料
| 型號： | SCG015 |
| 英文描述： | Watt, High Linearity InGaP HBT Amplifier |
| 中文描述： | 瓦，高線性InGaP HBT功率放大器 |
| 文件頁數(shù)： | 5/5頁 |
| 文件大?。?/td> | 211K |
| 代理商： | SCG015 |
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Specifications and information are subject to change without notice
Page 5 of 5 October 2006
SCG015
Watt, High Linearity InGaP HBT Amplifier
Product Information
The Communications Edge
TM
SCG015B-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
°
C reflow temperature) and leaded
(maximum 245
°
C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85
°
C.
2. This corresponds to the typical biasing condition of
+5V, 100 mA at an 85
°
C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 247
°
C.
Tjc = Tcase + Rth * Vde * Icc
Rating
-40 to +85
°
C
128
°
C / W
149
°
C
Product Marking
The component will be marked with an
“S015G” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Value:
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260
°
C convection reflow
Standard: JEDEC Standard J-STD-020
Passes at between 500 and 1000V
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board
to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
MTTF vs. GND Tab Temperature
100
1000
10000
100000
60
70
80
90
100
110
120
Tab Temperature (°C)
相關PDF資料 |
PDF描述 |
|---|---|
| SCG015_06 | Watt, High Linearity InGaP HBT Amplifier |
| SCG015B-G | Watt, High Linearity InGaP HBT Amplifier |
| SCG015B-PCB1960 | Watt, High Linearity InGaP HBT Amplifier |
| SCG015B-PCB2140 | Watt, High Linearity InGaP HBT Amplifier |
| SCN2651 | Programmable communications interface PCI |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| SCG015_06 | 制造商:WJCI 制造商全稱:WJCI 功能描述: Watt, High Linearity InGaP HBT Amplifier |
| SCG015B | 制造商:WJCI 制造商全稱:WJCI 功能描述:1/4 Watt, High Linearity InGaP HBT Amplifier |
| SCG015B-G | 功能描述:射頻放大器 1800-2500MHz 15dB Gain RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| SCG015B-PCB1960 | 制造商:WJCI 制造商全稱:WJCI 功能描述: Watt, High Linearity InGaP HBT Amplifier |
| SCG015B-PCB2140 | 制造商:WJCI 制造商全稱:WJCI 功能描述: Watt, High Linearity InGaP HBT Amplifier |
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