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參數(shù)資料
| 型號： | SCD5584 |
| 廠商： | SIEMENS A G |
| 元件分類： | 顯示用LED |
| 英文描述： | Serial Input Dot Addressable Intelligent Display |
| 中文描述： | 5X5 DOT MATRIX DISPLAY, HIGH EFFICIENCY GREEN, 3.68 mm |
| 封裝： | PLASTIC, DIP-28 |
| 文件頁數(shù)： | 9/15頁 |
| 文件大?。?/td> | 113K |
| 代理商： | SCD5584 |
2–9
SCD5580/5581/5582/5583/5584
Table 6. Lamp test
Table 7. Software clear
Multiplexer and Display Driver
The eight characters are row multiplexed with RAM resident
column data. The strobe rate is established by the internal or
external MUX Clock rate. The MUX Clock frequency is
divided by a 320 counter chain. This results in a typical
strobe rate of 750Hz. By pulling the Clock SEL line low, the
display can be operated from an external MUX Clock. The
external clock is attached to the CLK I/O connection (pin 15).
The maximum external MUX Clock frequency should be lim-
ited to 1 MHz.
An asynchronous hardware Reset (pin 13) is also provided.
Bringing this pin low will clear the Character Address Regis-
ter, Control Word Register, RAM, and blanks the display. This
action leaves the display set at Character Address 0, and the
Brightness Level set at 100%.
Electrical & Mechanical Considerations
Interconnect Considerations
Optimum product performance can be had when the follow-
ing electrical and mechanical recommendations are
adopted. The SCD558X’s IC is constructed in a high speed
CMOS process, consequently high speed noise on the
SERIAL DATA, SERIAL DATA CLOCK, LOAD and RESET
lines may cause incorrect data to be written into the serial
shift register. Adhere to transmission line termination proce-
dures when using fast line drivers and long cables (>10 cm).
Good digital grounds (pins 14, 28) and power supply decou-
pling (pins 6, 9, 20, 23) will insure that I
CC
(<400 mA peak)
switching currents do not generate localized ground bounce.
Therefore it is recommended that each display package use
a 0.1
μ
F and 20
μ
F capacitor between V
CC
and ground.
When the internal MUX Clock is being used connect the
CLKSEL pin to V
CC
. In those applications where RESET
will not be connected to the system’s reset control, it is rec-
ommended that this pin be connected to the center node of
a series 0.1,
μ
F and 100 K
RC network. Thus upon initial
power up the RESET will be held low for 10 ms allowing ade-
quate time for the system power supply to stabilize.
The SCD558X allows up to 1.7 W of power dissipation at 70
°
and 1.29 W power dissipation at a maximum operating tem-
Opcode
Control Word
Hex Operation
D7
D6
D5
D4
D3
D2
D1
D0
1
1
1
1
0
B
B
B
Lamp Test
(OFF)
1
1
1
1
1
0
0
0
F8
Lamp Test
(ON)
Opcode
Control Word
Hex Operation
D7
D6
D5
D4
D3
D2
D1
D0
1
1
0
0
0
0
0
0
C0
CLEAR
perature of 85
°
C. Approximately 60% of this power is dissi-
pated by the IC to the PC board via the V
CC
connection (pins
6, 9, 20, 23). Optimum thermal reliability is obtained by con-
necting all of the V
CC
pins to a common pad located on both
sides of the PC board. This technique offers a low thermal
resistance for IC to system ambient.
ESD Protection
The input protection structure of the SCD5580/1/2/3/4 pro-
vides significant protection against ESD damage. It is capa-
ble of withstanding discharges greater than 2 KV. Take all the
standard precautions, normal for CMOS components. These
include properly grounding personnel, tools, tables, and
transport carriers that come in contact with unshielded parts.
If these conditions are not, or cannot be met, keep the leads
of the device shorted together or the parts in anti-static pack-
aging.
Soldering Considerations
THE SCD5580/1/2/3/4 can be hand soldered with SN63 sol-
der using a grounded iron set to 260
°
C.
Wave soldering is also possible following these conditions:
Preheat that does not exceed 93
°
C on the solder side of the
PC board or a package surface temperature of 85
°
C. Water
soluble organic acid flux (except carboxylic acid) or resin-
based RMA flux without alcohol can be used.
Wave temperature of 245
°
C
±
5
°
C with a dwell between 1.5
sec. to 3.0 sec. Exposure to the wave should not exceed tem-
peratures above 260
°
C for five seconds at 0.063" below the
seating plane. The packages should not be immersed in the
wave.
Post Solder Cleaning Procedures
The least offensive cleaning solution is hot D.I. water (60
°
C)
for less than 15 minutes. Addition of mild saponifiers is
acceptable. Do not use commercial dishwasher detergents.
For faster cleaning, solvents may be used. Exercise care in
choosing solvents as some may chemically attack the nylon
package. Maximum exposure should not exceed two minutes
at elevated temperatures. Acceptable solvents are TF (tri-
chorotrifluorethane), TA, 111 Trichloroethane, and unheated
acetone.
(1)
Note: 1.Acceptable commercial solvents are: Basic TF, Arklone, P.
Genesolv, D. Genesolv DA, Blaco-Tron TF, Blaco-Tron TA,
and Freon TA.
Unacceptable solvents contain alcohol, methanol, methylene
chloride, ethanol, TP35, TCM, TMC, TMS+, TE, or TES. Since
many commercial mixtures exist, contact a solvent vendor
for chemical composition information. Some major solvent
manufacturers are: Allied Chemical Corporation, Specialty
Chemical Division, Morristown, NJ ; Baron-Blakeslee, Chi-
cago, IL; Dow Chemical, Midland, MI; E.I. DuPont de Nem-
ours & Co., Wilmington, DE.
For further information refer to Appnotes 18 and 19 in the cur-
rent Siemens Optoelectronic Data Book.
An alternative to soldering and cleaning the display modules
is to use sockets. Naturally, 28 pin DIP sockets .300" wide
with .100" centers work well for single displays. Multiple dis-
play assemblies are best handled by longer SIP sockets or
DIP sockets when available for uniform package alignment.
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