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參數(shù)資料
| 型號： | SAL-C167CS-L33C |
| 廠商： | INFINEON TECHNOLOGIES AG |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 16-BIT, MROM, 33 MHz, MICROCONTROLLER, UUC146 |
| 封裝： | DIE-146 |
| 文件頁數(shù)： | 16/25頁 |
| 文件大?。?/td> | 796K |
| 代理商： | SAL-C167CS-L33C |
Data Sheet
21
V2.0, 2004-10
C167CS-xC Bare Die
Step CA
Mechanical Parameters
The wafers are glued to a plastic tape which is fixed within a metal frame (see Figure 5).
Wafers can be shipped in one piece or sawn into individual dies.
Note: Please refer also to the document "Bare Die Packing Information".
Table 7
Wafer Characteristics
Item
Characteristic
Chips per wafer
674 (geometrically)
Metallization layers
2
Metallization material
AlCu
Metallization thickness
Met1: 400 nm, Met2: 800 nm
Metallization barrier material
Ti
Metallization isolation
SOG-CMP
Metallization material on pads
AlSiCu (Al 98.5% - SI 1% - Cu 0.5%)
Passivation
Oxide (200 nm) + nitride (300 nm)
+ polyimide (5.5±0.5
m)
Backside metallization1)
1) The backside of the chip can either be left unconnected or must be connected to VSS.
None (silicon)
Inkdot diameter
1.0 - 1.3 typical
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