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參數(shù)資料
| 型號(hào)： | SAK-C167CS-4R40M-BA |
| 廠商： | INFINEON TECHNOLOGIES AG |
| 元件分類(lèi)： | 微控制器/微處理器 |
| 英文描述： | 16-BIT, MROM, 40 MHz, MICROCONTROLLER, PQFP144 |
| 封裝： | METRIC, PLASTIC, QFP-144 |
| 文件頁(yè)數(shù)： | 66/72頁(yè) |
| 文件大?。?/td> | 1254K |
| 代理商： | SAK-C167CS-4R40M-BA |
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1998 Dec 14
69
Philips Semiconductors
Preliminary specication
Economy teletext and TV microcontrollers
SAA5x9x family
18.4
Suitability of IC packages for wave, reow and dipping soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
MOUNTING
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
DIPPING
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
suitable(2)
suitable
Surface mount
BGA, SQFP
not suitable
suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS
not suitable(3)
suitable
PLCC(4), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(4)(5)
suitable
SSOP, TSSOP, VSO
not recommended(6)
suitable
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| SAK-C167CS-4RC | 16-BIT, MROM, 33 MHz, MICROCONTROLLER, UUC146 |
| SAK-C167CS-LC | 16-BIT, MROM, 33 MHz, MICROCONTROLLER, UUC146 |
| SAL-C167CS-L33C | 16-BIT, MROM, 33 MHz, MICROCONTROLLER, UUC146 |
| SAK-C504-L40M | 8-BIT, 20 MHz, MICROCONTROLLER, PQFP44 |
| SAK-C509-LM | 8-BIT, 16 MHz, MICROCONTROLLER, PQFP100 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SAK-C167CS-4RM | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:16-Bit Single-Chip Microcontroller |
| SAK-C167CS-L33M | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Infineon Technologies AG 功能描述: |
| SAK-C167CS-L33M CA+ | 功能描述:16位微控制器 - MCU 16BIT SNGL CHIP 5V 33MHz ROM less RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT |
| SAK-C167CS-L33M-CA | 制造商:Infineon Technologies AG 功能描述: |
| SAKC167CSL33MCA+ | 制造商:Infineon Technologies AG 功能描述: |
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