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參數(shù)資料
| 型號： | SA58670BS |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 音頻放大器 |
| 英文描述： | 2.1 W-channel stereo class-D audio amplifier |
| 封裝： | SA58670BS<SOT917-1 (HVQFN20)|<<http://www.nxp.com/packages/SOT917-1.html<1<Always Pb-free,; |
| 文件頁數(shù)： | 10/25頁 |
| 文件大?。?/td> | 167K |
| 代理商： | SA58670BS |
SA58670_3
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 11 June 2009
18 of 25
NXP Semiconductors
SA58670
2.1 W/channel stereo class-D audio amplier
11.5 Efciency and thermal considerations
The maximum ambient operating temperature depends on the heat transferring ability of
the heat spreader on the PCB layout. In Table 3 “Limiting values”, the power derating
factor is given as 41.6 mW/K. The device thermal resistance, Rth(j-a) is the reciprocal of the
(3)
For a maximum allowable junction temperature Tj = 150 °C and Rth(j-a) = 24 K/W and a
maximum device dissipation of 1.5 W (750 mW per channel) and for 2.1 W per channel
output power, 4
load, 5 V supply, the maximum ambient temperature is calculated using
(4)
The maximum ambient temperature is 114
°C at maximum power dissipation for 5 V
supply and 4
load. If the junction temperature of the SA58670 rises above 150 °C, the
thermal protection circuitry turns the SA58670 off; this prevents damage to IC. Using
speakers greater than 4
further enhances thermal performance and battery lifetime by
reducing the output load current and increasing amplier efciency.
11.6 Additional thermal information
The SA58670 HVQFN20 package incorporates an exposed DAP that is designed to
solder the mount directly to the PCB heat spreader. By the use of thermal vias, the DAP
may be soldered directly to a ground plane or special heat sinking layer designed into the
PCB. The thickness and area of the heat spreader may be maximized to optimize heat
transfer and achieve lowest package thermal resistance.
R
th j-a
()
1
derating factor
------------------------------------------
1
0.0416
----------------
24 K /W
==
=
T
amb max
()
T
j max
()
R
th j-a
()
P
max
×
()
–
150
24
1.5
×
()
–
114
°C
==
=
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SA58670BS,115 | 功能描述:音頻放大器 2.1W/CH CLASS D RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58670BS-G | 功能描述:音頻放大器 2.1W/CH CLASS D AUDIO AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58671 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1.2 W/channel stereo class-D audio amplifier |
| SA58671UK | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1.2 W/channel stereo class-D audio amplifier |
| SA58671UK,027 | 功能描述:音頻放大器 1.2W/CH CLASS D RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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