參數資料
型號: SA58637BS
廠商: NXP Semiconductors N.V.
元件分類: 音頻放大器
英文描述: 2 x 2.2 W BTL audio amplifier
封裝: SA58637BS<SOT910-1 (HVQFN20)|<<http://www.nxp.com/packages/SOT910-1.html<1<Always Pb-free,;
文件頁數: 19/22頁
文件大?。?/td> 156K
代理商: SA58637BS
SA58637_1
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 25 February 2008
6 of 22
NXP Semiconductors
SA58637
2
× 2.2 W BTL audio amplier
[1]
HIGH = VSELECT >VCC 0.5 V.
[2]
n.c. = not connected or oating.
[3]
X = don’t care.
[4]
HVCC = 1.5 V < VSELECT <VCC 1.5 V.
[5]
LOW = VSELECT < 0.5 V.
9.
Limiting values
10. Thermal characteristics
[1]
Thermal resistance is 22 K/W with DAP soldered to 64.5 mm2 (10 in2), 28.3 g (1 oz) copper heat spreader.
11. Static characteristics
HIGH[1]
mute/on
standby
8
HVCC[4]/n.c.[2]
mute/on
15
standby
mute/on
8
Table 4.
Control pins MODE and SELECT versus status of output channels …continued
Voltage levels at control pins at VCC = 5 V; for other voltage levels see Figure 6 and Figure 7.
Control pin
Status of output channel
Typical Iq (mA)
MODE
SELECT
Left channel
Right channel
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
supply voltage
operating
0.3
+18
V
VI
input voltage
0.3
VCC + 0.3
V
IORM
repetitive peak output current
-
1
A
Tstg
storage temperature
non-operating
55
+150
°C
Tamb
ambient temperature
operating
40
+85
°C
VCC(sc)
supply voltage (short circuit)
-
10
V
Ptot
total power dissipation
-
2.2
W
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from
junction to ambient
in free air
80
K/W
with heat spreader
K/W
Rth(j-sp)
thermal resistance from
junction to solder point
3
K/W
Table 7.
Static characteristics
VCC =6V; Tamb =25 °C; RL =8 ; VMODE = 0 V; measured in test circuit Figure 3; unless otherwise specied.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCC
supply voltage
operating
2.2
9
18
V
Iq
quiescent current
RL = ∞
[1] -15
22
mA
Istb
standby current
VMODE =VCC
--
10
A
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