參數(shù)資料
型號(hào): SA5217
廠商: NXP Semiconductors N.V.
英文描述: Postamplifier with link status indicator
中文描述: 后置連接狀態(tài)指示燈與
文件頁(yè)數(shù): 8/12頁(yè)
文件大小: 98K
代理商: SA5217
Philips Semiconductors
Product specification
SA5217
Postamplifier with link status indicator
1998 Oct 07
8
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
1
2
3
4
5
6
7
8
9
10
11
12
13
14
LED
C
PKDET
THRESH
GND
A
FLAG
JAM
V
CCD
V
CCA
GND
D
TTL
OUT
IN
1B
IN
1A
C
AZP
C
AZN
OUT
2B
IN
8B
OUT
2A
IN
8A
R
HYST
R
PKDET
N
GND
GND
GND
OUT
1
GND
GND
OUT
2
V
CC1
V
CC2
NC
I
IN
NC
GND
GND
N
R2
220
D1
LED
C11
100pF
100pF
C7
.01
μ
F
47
μ
F
C1
C2
GND
+V
CC
0.1
μ
F
0.1
μ
F
0.1
μ
F
R4
4k
R3
33k
V
OUT
(TTL)
L3
10
μ
H
L2
10
μ
H
C12
C13
10
μ
F
.01
μ
F
.01
μ
F
C14
C15
10
μ
F
C8
C9
C10
L1
10
μ
H
BPF31
OPTICAL
INPUT
R1
100
C5
1.0
μ
F
C6
.01
μ
F
.01
μ
F
C4
10
μ
F
C3
NOTE:
THE NE5210/NE5217 combination can operate at data rates in excess of 100Mb/s NRZ
R5
10k
SD00359
Figure 6. A 50Mb/s Fiber Optic Receiver
For more information on this application, please refer to Application
Brief AB1432.
Die Sales Disclaimer
Due to the limitations in testing high frequency and other parameters
at the die level, and the fact that die electrical characteristics may
shift after packaging, die electrical parameters are not specified and
die are not guaranteed to meet electrical characteristics (including
temperature range) as noted in this data sheet which is intended
only to specify electrical characteristics for a packaged device.
All die are 100% functional with various parametrics tested at the
wafer level, at room temperature only (25
°
C), and are guaranteed to
be 100% functional as a result of electrical testing to the point of
wafer sawing only. Although the most modern processes are
utilized for wafer sawing and die pick and place into waffle pack
carriers, it is impossible to guarantee 100% functionality through this
process. There is no post waffle pack testing performed on
individual die.
Since Philips Semiconductors has no control of third party
procedures in the handling or packaging of die, Philips
Semiconductors assumes no liability for device functionality or
performance of the die or systems on any die sales.
Although Philips Semiconductors typically realizes a yield of 85%
after assembling die into their respective packages, with care
customers should achieve a similar yield. However, for the reasons
stated above, Philips Semiconductors cannot guarantee this or any
other yield on any die sales.
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參數(shù)描述
SA5217D 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Postamplifier with link status indicator
SA5217D,602 功能描述:高速運(yùn)算放大器 POST AMP WITH LINK STATUS IND RoHS:否 制造商:NXP Semiconductors 通道數(shù)量: 電壓增益 dB: 輸入補(bǔ)償電壓: 轉(zhuǎn)換速度: 工作電源電壓: 電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SO-20 封裝:Tube 產(chǎn)品:
SA5217D/01 功能描述:特殊用途放大器 POST AMP W/LINK STATUS RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比(最小值): 輸入補(bǔ)償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel
SA5217D/01,112 功能描述:特殊用途放大器 POST AMP W/LINK RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比(最小值): 輸入補(bǔ)償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel
SA5217D/01,118 功能描述:特殊用途放大器 POST AMP W/LINK RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比(最小值): 輸入補(bǔ)償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel