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參數(shù)資料
| 型號： | S72NS128RD0AHBG40 |
| 廠商： | SPANSION LLC |
| 元件分類： | 存儲器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA133 |
| 封裝： | 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133 |
| 文件頁數(shù)： | 3/13頁 |
| 文件大?。?/td> | 619K |
| 代理商： | S72NS128RD0AHBG40 |
May 10, 2010 S72NS-R_00_07
S72NS-R Based MCPs
11
Da ta
Sh e e t
(Adv a n ce
In f o r m ation)
6.3
ALF128—128-ball Fine-Pitch Ball Grid Array (FBGA) 12.0 x 12.0 mm
PACKAGE
ALF 128
JEDEC
N/A
D x E
12.00 mm x 12.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
0.85
0.95
1.05
PROFILE
A1
0.38
0.43
0.48
BALL HEIGHT
A2
0.49
0.54
0.59
BODY THICKNESS
D
12.00 BSC.
BODY SIZE
E
12.00 BSC.
BODY SIZE
D1
11.05 BSC.
MATRIX FOOTPRINT
E1
11.05 BSC.
MATRIX FOOTPRINT
MD
18
MATRIX SIZE D DIRECTION
ME
18
MATRIX SIZE E DIRECTION
n
128
BALL COUNT
N
128
MAXIMUM NUMBER OF BALLS
R
2
NUMBER OF LAND PERIMETERS
b
0.43
0.48
0.53
BALL DIAMETER
eE
0.65 BSC.
BALL PITCH
eD
0.65 BSC.
BALL PITCH
SE / SD
0.325 BSC.
SOLDER BALL PLACEMENT
C3-C16,D3-D16,E3-E16,
DEPOPULATED SOLDER BALLS
F3-F16,G3-G16,H3-H16,
J3-J16,K3-K16,L3-L16,
M3-M16,N3-N16,P3-P16,
R3-R16,T3-T16
3658 \ 16-038.24 \ 10.12.7
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JEP95, SECTION
3.0, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
N IS THE MAXIMUM NUMBER OF BALLS ON THE FBGA PACKAGE.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
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