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參數(shù)資料
| 型號(hào)： | S71WS256NC0BAWAK2 |
| 廠商： | SPANSION LLC |
| 元件分類： | 存儲(chǔ)器 |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA84 |
| 封裝： | 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84 |
| 文件頁(yè)數(shù)： | 1/13頁(yè) |
| 文件大?。?/td> | 332K |
| 代理商： | S71WS256NC0BAWAK2 |
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Publication Number S71WS-N_00
Revision A
Amendment 6
Issue Date July 19, 2006
S71WS-N
S71WS-N Cover Sheet
Stacked Multi-Chip Product (MCP)
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with CellularRAM
Data Sheet (Advance Information)
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
相關(guān)PDF資料 |
PDF描述 |
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| S71WS256NC0BAWAK3 | Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAN0 | Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAN2 | Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAN3 | Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAP0 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S71WS256NC0BAWAK3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAN0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAN2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAN3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAP0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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