參數(shù)資料
型號: S71GL064A08BAW0B3
廠商: SPANSION LLC
元件分類: 存儲器
英文描述: Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA56
封裝: 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
文件頁數(shù): 15/134頁
文件大?。?/td> 2383K
代理商: S71GL064A08BAW0B3
February 8, 2005 S71GL064A_00_A2
pSRAM Type 7
109
Adva nc e
inf o r m at ion
AC Characteristics
Power Down Parameters
Notes:
1. Applicable also to power-up.
2. Applicable when 4Mb and 8Mb Partial modes are programmed.
Other Timing Parameters
Notes:
1. Some data might be written into any address location if tCHWX(min) is not satisfied.
2. The Input Transition Time (tT) at AC testing is 5ns as shown in below. If actual tT is longer than 5ns, it can violate the AC
specification of some of the timing parameters.
Parameter
Symbol
16M
32M
64M
Unit
Note
Min.
Max.
Min.
Max.
Min.
Max.
CE2 Low Setup Time for Power Down Entry
tCSP
10
10
10
ns
CE2 Low Hold Time after Power Down Entry
tC2LP
80
65
65
ns
CE1# High Hold Time following CE2 High after Power
Down Exit [SLEEP mode only]
tCHH
300
300
300
s
1
CE1# High Hold Time following CE2 High after Power
Down Exit [not in SLEEP mode]
tCHHP
N/A
1
1
s
2
CE1# High Setup Time following CE2 High after Power
Down Exit
tCHS
0
0
0
ns
1
Parameter
Symbol
16M
32M
64M
Unit
Note
Min.
Max.
Min.
Max.
Min.
Max.
CE1# High to OE# Invalid Time for Standby Entry
tCHOX
10
10
10
ns
CE1# High to WE# Invalid Time for Standby Entry
tCHWX
10
10
10
ns
1
CE2 Low Hold Time after Power-up
tC2LH
50
50
50
s
CE1# High Hold Time following CE2 High after Power-up
tCHH
300
300
300
s
Input Transition Time
tT
1
25
1
25
1
25
ns
2
相關(guān)PDF資料
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S71GL064A08BAW0F3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0B2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
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S71GL064A08BFI0F3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFW0B2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
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S71GL064A08BAW0F0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
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