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參數(shù)資料
| 型號(hào)： | S595-93-370-19-125082 |
| 廠商： | MILL-MAX MFG CORP |
| 元件分類： | 插座 |
| 英文描述： | PGA370, IC SOCKET |
| 文件頁(yè)數(shù)： | 1/2頁(yè) |
| 文件大?。?/td> | 303K |
| 代理商： | S595-93-370-19-125082 |
MAXIMUM
solutions
R
Maximum Interconnect Solutions
Mill-Max Mfg. Corp. 190 Pine Hollow Road, Oyster Bay, NY 11771-0300
516-922-6000 Fax: 516-922-9253 www.mill-max.com
(8/02-489)
Mill-Max now offers solder pre-forms.
Solder pre-forms enhance the assembly
of large pin grid array (PGA) sockets.
The main benefit of solder pre-forms is
the placement of solder directly between
the lead and the hole. This ensures a
good solder joint.
Solder pre-forms allow our customers to
attach thru-hole devices onto a board
soldered using reflow methods. This
allows for mixed technology boards.
The solder pre-form is 63% tin and 37%
lead.
All Mill-Max sockets use precision machined pins which eliminate any possibility of solder wicking
or flux contamination. Press-fit into each pin receptacle is a low force beryllium copper multi-finger
contact renowned for greater compliancy and proven reliability.
See the reverse side for an example of a typical PGA with solder pre-forms.
For additional information on these or any other Mill-Max interconnect components, contact our
application engineers at (516) 922-6000.
Mill-Max Solder Pre-forms
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