參數(shù)資料
型號: S29GL032M10TFCR12
廠商: Spansion Inc.
英文描述: CAP 0.39UF 50V 10% BX SMD-1825 TR-7-PL SN100% P-MIL-PRF-55681
中文描述: MirrorBit閃存系列
文件頁數(shù): 75/159頁
文件大?。?/td> 5216K
代理商: S29GL032M10TFCR12
22
S29GLxxxM MirrorBitTM Flash Family
S29GLxxxM_00_B3 Octorber 18, 2004
Data s he et
Table 1. S29GL032M Ordering Options
Notes:
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types
0, 2, or 3.
2. This package is recommended for new designs using TSOPs.
3. TSOP package marking omits packing type designator from the ordering part number.
4. BGA package marking omits leading “S29” and packing type designator from the ordering part number.
5. 100% Matte Sn is used for Pb-free TSOP plating.
6. SnBi is used for Pb-free TSOP plating.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales
office to confirm availability of specific valid combinations and to check on newly released combinations.
S29GL032M Valid Combinations
Package Description
Device
Number
Speed
Option
Package, Material, &
Temperature Range
Model
Number
Packing
Type
S29GL032M
90
TAC,TFC
R0
0,2,3
(note 1)
TS040 (note 2, 3, 5)
TSOP
BAC,BFC
FBC048 (note 4)
Fine-Pitch BGA
TAC,TFC
R1,R2
TS056 (note 2, 3, 5)
TSOP
FAC,FFC
LAA064 (note 4)
Fortified BGA
TAC,TFC
R3,R4
TS048 (note 2, 3, 5)
TSOP
BAC,BFC
FBC048 ((note 4)
Fine-Pitch BGA
FAC,FFC
LAA064 (note 4)
Fortified BGA
90, 10, 11
TAI,TFI
R0
TS040 (note 2, 3, 5)
TSOP
BAI,BFI
FBC048 (note 4)
Fine-Pitch BGA
TAI,TFI
R1,R2
TS056 (note 2, 3, 5)
TSOP
FAI,FFI
LAA064 (note 4)
Fortified BGA
TAI,TFI
R3,R4
TS048 (note 2, 3, 5)
TSOP
BAI,BFI
FBC048 (note 4)
Fine-Pitch BGA
FAI,FFI
LAA064 (note 4)
Fortified BGA
TBI,TCI
FPT-48P-M19 (note 3, 6)
TSOP
BAI,BFI
R5,R6
FBG048 (note 4)
Fine-Pitch BGA
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