參數(shù)資料
型號: S108T01
廠商: Sharp Corporation
英文描述: Low Profile Type Solid State Relays
中文描述: 超薄型固態(tài)繼電器
文件頁數(shù): 3/5頁
文件大?。?/td> 64K
代理商: S108T01
S108T01/S108T02/S208T01/S208T02
Fig.3 RMS ON-state Current vs. Case
Temperature
10
Fig.4 Forward Current vs. Forward Voltage
R
T
r
)
Case temperature T
C
(
°
C)
0
25
0
25
50
75
100
125
9
8
7
6
5
4
3
2
1
Fig.5 Surge Current vs. Power-on Cycle
S
s
Power-on cycle (Times)
0
1
10
100
f
=
60Hz
T
j
=
25
°
C start
100
80
60
40
20
Fig.2 RMS ON-state Current vs. Ambient
Temperature
9
R
T
r
)
Ambient temperature T
a
(
°
C)
0
25
8
7
6
5
4
3
2
1
100
75
50
25
125
0
(1)
(2)
(3)
(4)
(5)
4
Al plate
SSR
(1) With infinite heat sink
(2) With heat sink (200
×
200
×
2mm Al plate)
(3) With heat sink (100
×
100
×
2mm Al plate)
(4) With heat sink (50
×
50
×
2mm Al plate)
(5) Without heat sink
(Note) With the Al heat sink set up vertically, tighten the
device with a torque of 0.4Nm and apply thermal
conductive silicone grease on the mounting face of
heat sink. Forced cooling shall not be carried out.
(Please use an isolation sheet if necessary.)
F
F
Forward voltage V
F
(mA)
50
1.8
1.6
1.4
1.2
1.0
0.8
0.6
10
5
1
0.5
0.1
25
°
C
25
°
C
0
°
C
T
a
=
75
°
C
50
°
C
相關(guān)PDF資料
PDF描述
S108T02 Low Profile Type Solid State Relays
S10B-EH Disconnectable Crimp style connectors
S13B-EH Disconnectable Crimp style connectors
S12B-EH Disconnectable Crimp style connectors
S11B-EH Disconnectable Crimp style connectors
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