
RT9173/A
10
DS9173/A-18 March 2007
www.richtek.com
Figure 11. Power Dissipation vs. Copper Area of SOP-8
Package
Figure 12. Power Dissipation vs. Copper Area of
TO-263-5 Package
can be calculated as :
P
D(MAX)
= (125
°
C - 25
°
C) / (29
°
C/W) = 3.45W (TO-263-5)
Figure 11 and Figure 12 of power dissipation vs. copper
area allow the designer to see the effect of rising ambient
temperature on the maximum power allowed.
Cooper Area vs. Power Dissipation
0
50
100
150
200
250
300
350
400
0
0.5
1
1.5
Power Dissipation (W)
2
2.5
3
3.5
4
4.5
C
2
)
T
A
= 65
°
C
T
A
= 55
°
C
T
A
= 25
°
C
TO-263-5
2S2P thermal test
board
Power Dissipation vs. Copper Area
0
10
20
30
40
50
60
70
80
90
100
0
0.5
1
1.5
2
2.5
3
Power Dissipation (W)
C
2
)
T
A
= 65
°
C
T
A
= 55
°
C
T
A
= 25
°
C
2S2P thermal test
board
SOP-8