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參數(shù)資料
| 型號： | RT9173PL5 |
| 廠商： | Richtek Technology Corporation |
| 英文描述： | Peak 3A Bus Termination Regulator |
| 中文描述： | 山頂3A條總線終端穩(wěn)壓器 |
| 文件頁數(shù)： | 9/13頁 |
| 文件大?。?/td> | 317K |
| 代理商： | RT9173PL5 |
RT9173/A
9
DS9173/A-18 March 2007
www.richtek.com
Figure 7. The Package Section Drawing of RT9173/A
SOP-8 Package
Figure 8. Thermal Resistance Equivalent Circuit of
RT9173/A SOP-8 Package
The thermal resistance
θ
JA
of IC package is determined by
the package design and the PCB design. However, the
package design has been decided. If possible, it's useful
to increase thermal performance by the PCB design. The
thermal resistance can be decreased efficiently by adding
copper under the main path of thermal flow on the package.
The maximum power dissipation depends on operating
ambient temperature for fixed T
J(MAX)
and thermal
resistance
θ
JA
. For RT9173/A package, the Figure 9 and
the Figure 10 show the thermal resistance
θ
JA
vs. copper
area of SOP-8 and TO-263-5 packages on single layer
(1S) and 4-layer (2S2P) thermal test board at T
A
= 25
°
C,
PCB copper thickness = 2oz.
Figure 10. Thermal Resistance
θ
JA
vs. Copper Area of
TO-263-5 Packages
For example, as shown in Figure 9, RT9173/A SOP-8 with
10mm x 10mm cooper area on 4-layers (2S2P) thermal
test board at T
A
= 25
°
C, we can obtain the lower thermal
resistance about 45
°
C/W. The power maximum dissipation
can be calculated as :
P
D(MAX)
= (125
°
C - 25
°
C) / (45
°
C/W) = 2.22W (SOP-8)
As shown in Figure 10, RT9173/A TO-263-5 with
15mm x 15mm cooper area on 4-layers (2S2P) thermal
test board at T
A
= 25
°
C, we can obtain the lower thermal
resistance about 29
°
C/W. The power maximum dissipation
Ambient
Molding Compound
Gold Wire
Lead Frame
Die Pad
Die
Die Pad
Molding Compound
Lead Frame
Case Point
Junction
R
DIE
R
DIE-ATTACH
R
DIE-PAD
R
GOLD-LINE
R
LEAD FRAME
R
PCB
R
PCB
Ambient
R
MOLDING-COMPOUND
path 1
path 2
path 3
R
LEAD FRAME
Internally Fused
θ
JA
vs. Copper Area
30
40
50
60
70
80
90
100
0
10
20
30
Copper Area (mm
2
)
40
50
60
70
80
90
100
θ
J
SOP-8
2S2P thermal test board
Figure 9. Thermal Resistance
θ
JA
vs. Copper Area of
SOP-8 Packages
Thermal Resistance vs. Cooper Area
0
10
20
30
40
50
60
70
0
50
100
150
200
250
300
350
400
Cooper Area (mm
2
)
T
TO-263-5
1S thermal test board
2S2P thermal test board
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