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參數(shù)資料
| 型號(hào)： | RT9173APL5 |
| 廠商： | Richtek Technology Corporation |
| 英文描述： | Peak 3A Bus Termination Regulator |
| 中文描述： | 山頂3A條總線終端穩(wěn)壓器 |
| 文件頁數(shù)： | 9/13頁 |
| 文件大?。?/td> | 317K |
| 代理商： | RT9173APL5 |
RT9173/A
9
DS9173/A-18 March 2007
www.richtek.com
Figure 7. The Package Section Drawing of RT9173/A
SOP-8 Package
Figure 8. Thermal Resistance Equivalent Circuit of
RT9173/A SOP-8 Package
The thermal resistance
θ
JA
of IC package is determined by
the package design and the PCB design. However, the
package design has been decided. If possible, it's useful
to increase thermal performance by the PCB design. The
thermal resistance can be decreased efficiently by adding
copper under the main path of thermal flow on the package.
The maximum power dissipation depends on operating
ambient temperature for fixed T
J(MAX)
and thermal
resistance
θ
JA
. For RT9173/A package, the Figure 9 and
the Figure 10 show the thermal resistance
θ
JA
vs. copper
area of SOP-8 and TO-263-5 packages on single layer
(1S) and 4-layer (2S2P) thermal test board at T
A
= 25
°
C,
PCB copper thickness = 2oz.
Figure 10. Thermal Resistance
θ
JA
vs. Copper Area of
TO-263-5 Packages
For example, as shown in Figure 9, RT9173/A SOP-8 with
10mm x 10mm cooper area on 4-layers (2S2P) thermal
test board at T
A
= 25
°
C, we can obtain the lower thermal
resistance about 45
°
C/W. The power maximum dissipation
can be calculated as :
P
D(MAX)
= (125
°
C - 25
°
C) / (45
°
C/W) = 2.22W (SOP-8)
As shown in Figure 10, RT9173/A TO-263-5 with
15mm x 15mm cooper area on 4-layers (2S2P) thermal
test board at T
A
= 25
°
C, we can obtain the lower thermal
resistance about 29
°
C/W. The power maximum dissipation
Ambient
Molding Compound
Gold Wire
Lead Frame
Die Pad
Die
Die Pad
Molding Compound
Lead Frame
Case Point
Junction
R
DIE
R
DIE-ATTACH
R
DIE-PAD
R
GOLD-LINE
R
LEAD FRAME
R
PCB
R
PCB
Ambient
R
MOLDING-COMPOUND
path 1
path 2
path 3
R
LEAD FRAME
Internally Fused
θ
JA
vs. Copper Area
30
40
50
60
70
80
90
100
0
10
20
30
Copper Area (mm
2
)
40
50
60
70
80
90
100
θ
J
SOP-8
2S2P thermal test board
Figure 9. Thermal Resistance
θ
JA
vs. Copper Area of
SOP-8 Packages
Thermal Resistance vs. Cooper Area
0
10
20
30
40
50
60
70
0
50
100
150
200
250
300
350
400
Cooper Area (mm
2
)
T
TO-263-5
1S thermal test board
2S2P thermal test board
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| RT9173BGL5 | 2A Bus Termination Regulator |
| RT9173BGS | 2A Bus Termination Regulator |
| RT9173BPL5 | 2A Bus Termination Regulator |
| RT9173BPS | 2A Bus Termination Regulator |
| RT9174GS | Triple Linear Regulator Controllers |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| RT9173APM5 | 制造商:Richtek Technology Corporation 功能描述: |
| RT9173BGL5 | 功能描述:IC REG BUS TERMINATIN 2A TO252-5 RoHS:是 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 專用型 系列:- 標(biāo)準(zhǔn)包裝:43 系列:- 應(yīng)用:控制器，Intel VR11 輸入電壓:5 V ~ 12 V 輸出數(shù):1 輸出電壓:0.5 V ~ 1.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:48-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:48-QFN（7x7） 包裝:管件 |
| RT9173BGS | 功能描述:IC REG BUS TERMINATION 2A 8SOP RoHS:是 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 專用型 系列:- 標(biāo)準(zhǔn)包裝:43 系列:- 應(yīng)用:控制器，Intel VR11 輸入電壓:5 V ~ 12 V 輸出數(shù):1 輸出電壓:0.5 V ~ 1.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:48-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:48-QFN（7x7） 包裝:管件 |
| RT9173BPS | 制造商:RICHTEK 功能描述:REGULATOR |
| RT9173CGSP | 功能描述:IC REG BUS TERMINATION 2A 8SOP RoHS:是 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 專用型 系列:- 標(biāo)準(zhǔn)包裝:2,000 系列:- 應(yīng)用:控制器，DSP 輸入電壓:4.5 V ~ 25 V 輸出數(shù):2 輸出電壓:最低可調(diào)至 1.2V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:30-TFSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:30-TSSOP 包裝:帶卷 (TR) |
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