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參數(shù)資料
| 型號(hào)： | RT9017-2HGP |
| 廠商： | Richtek Technology Corporation |
| 英文描述： | 500mA Peak, Thermal Folded Back CMOS LDO Regulator |
| 中文描述： | 500mA峰值，熱折疊返回的CMOS LDO穩(wěn)壓器 |
| 文件頁數(shù)： | 9/12頁 |
| 文件大?。?/td> | 317K |
| 代理商： | RT9017-2HGP |
RT9017
Preliminary
9
DS9017-03 August 2007
www.richtek.com
Figure 3. Derating Curve for Packages
For continuous operation, do not exceed absolute
maximum operation junction temperature 125
°
C. The
power dissipation definition in device is :
P
D
= (V
IN
V
OUT
) x I
OUT
+ V
IN
x I
Q
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
be calculated by following formula :
P
D(MAX)
= ( T
J(MAX)
- T
A
) /
θ
JA
Where T
J(MAX)
is the maximum operation junction
temperature 125
°
C, T
A
is the ambient temperature and the
θ
JA
is the junction to ambient thermal resistance.
For recommended operating conditions specification of
RT9017, where T
J(MAX)
is the maximum junction
temperature of the die (125
°
C) and T
A
is the maximum
ambient temperature. The junction to ambient thermal
resistance (
θ
JA
is layout dependent) for SOT-23-3/SOT-
23-5 package is 250
°
C/W and WDFN-6L 2x2 package is
165
°
C/W on standard JEDEC 51-3 thermal test board.
The maximum power dissipation at T
A
= 25
°
C can be
calculated by following formula :
P
D(MAX)
=
(125
°
C
25
°
C)/250 = 400 mW
(
SOT-23-3
/
SOT-23-5)
P
D(MAX)
= (125
°
C
25
°
C)/333 = 300 mW (SC-70-5)
The maximum power dissipation depends on opera
ting
ambient temperature for fixed T
J(MAX)
and thermal
resistance
θ
JA
. For RT9017 packages, the Figure 3. of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
allowed.
0
100
200
300
400
500
600
700
0
25
50
75
100
125
150
Ambient Temperature (°C)
P
SOT-23-3/
SOT-23-5
WDFN-6L 2x2
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| RT9017-2HGQW | 500mA Peak, Thermal Folded Back CMOS LDO Regulator |
| RT9017-2HPB | 500mA Peak, Thermal Folded Back CMOS LDO Regulator |
| RT9017-2HPBR | 500mA Peak, Thermal Folded Back CMOS LDO Regulator |
| RT9017-2HPP | 500mA Peak, Thermal Folded Back CMOS LDO Regulator |
| RT9017-2HPQW | 500mA Peak, Thermal Folded Back CMOS LDO Regulator |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| RT9017-2HGQW | 制造商:RICHTEK 制造商全稱:Richtek Technology Corporation 功能描述:500mA Peak, Thermal Folded Back CMOS LDO Regulator |
| RT9017-2HPB | 制造商:RICHTEK 制造商全稱:Richtek Technology Corporation 功能描述:500mA Peak, Thermal Folded Back CMOS LDO Regulator |
| RT9017-2HPBR | 制造商:RICHTEK 制造商全稱:Richtek Technology Corporation 功能描述:500mA Peak, Thermal Folded Back CMOS LDO Regulator |
| RT9017-2HPP | 制造商:RICHTEK 制造商全稱:Richtek Technology Corporation 功能描述:500mA Peak, Thermal Folded Back CMOS LDO Regulator |
| RT9017-2HPQW | 制造商:RICHTEK 制造商全稱:Richtek Technology Corporation 功能描述:500mA Peak, Thermal Folded Back CMOS LDO Regulator |
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