參數(shù)資料
型號: RT9016-1HGQW
廠商: Richtek Technology Corporation
英文描述: 500mA Peak, Thermal Folded Back CMOS LDO Regulator
中文描述: 500mA峰值,熱折疊返回的CMOS LDO穩(wěn)壓器
文件頁數(shù): 9/11頁
文件大?。?/td> 309K
代理商: RT9016-1HGQW
RT9016
9
DS9016-03 August 2007
www.richtek.com
Preliminary
P
D(MAX)
= ( T
J(MAX)
T
A
) /
θ
JA
Where T
J(MAX)
is the maximum operation junction
temperature 125
°
C, T
A
is the ambient temperature and
the
θ
JA
is the junction to ambient thermal resistance.
For recommended operating conditions specification of
RT9016, where T
J(MAX)
is the maximum junction
temperature of the die (125
°
C) and T
A
is the maximum
ambient temperature. The junction to ambient thermal
resistance (
θ
JA
is layout dependent) for SOT-23-5 package
is 250
°
C/W and WDFN-6L 2x2 package is 165
°
C/W on
standard JEDEC 51-3 thermal test board. The maximum
power dissipation at T
A
= 25
°
C can be calculated by
following formula :
P
D(MAX)
= (125
°
C
25
°
C) / 250 = 400mW (SOT-23-5)
P
D(MAX)
= (125
°
C
25
°
C) / 165 = 606mW V(DFN-6L 2x2)
The maximum power dissipation depends on operating
ambient temperature for fixed T
J(MAX)
and thermal
resistance
θ
JA
. For RT9016 packages, the Figure 3 of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
allowed.
Figure 3. Derating Curve for Packages
Figure 2.
Short Circuit Thermal Folded Back Pro
tection
when Output Short Circuit Occurs
V
OUT
Short to GND
0.4V
V
OUT
I
OUT
TSD
OTP Trip Point
165 C
110 C
110 C
80 C
IC Temperature
0
100
200
300
400
500
600
700
0
25
50
75
100
125
150
Ambient Temperature (°C)
P
SOT-23-5
WDFN-6L 2x2
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相關(guān)代理商/技術(shù)參數(shù)
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