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參數(shù)資料
| 型號(hào)： | RP1-H-9V |
| 英文描述： | LOW PROFILE HIGH FREQUENCY RELAY |
| 中文描述： | 低收縮高頻繼電器 |
| 文件頁(yè)數(shù)： | 4/4頁(yè) |
| 文件大?。?/td> | 88K |
| 代理商： | RP1-H-9V |
9/1/2000
RP
9. High frequency switching test (1.2 GHz, 1 W)
Sample: RP1-6V; No. of samples: n = 6
Ambient temperature: 20°C
68°F
NOTES
1. Packing direction
Relays are packed in a tube with the ori-
entation stripe (PIN NO. 1) toward the
green stopper.
T1
T2
T1
T2
0.2s
0.2s
1.5s
1.5s
OFF
Trans-
mission
Dummy load (50
)
WD-2351
Transmission: RF Tranceiver
IC-1201 (ICOH)
ON
RP relay
Orientation (indicates PIN No. 1) stripe
Stopper (green)
A
C
B
Direction A Direction B Direction C
mm
inch
5 4
6
2 3
3
.118
6
.236
1
123
(4)
(5)
(6)
Change of pick-up/drop-out voltage
Change of contact resistance
2
4
6
8
10
12
15
10
5
0
Max.
Min.
Max.
No. of operations,
×
10
4
P
Pick-up voltage
Drop-out voltage
20
40
60
80
100
120
15
10
5
No. of operations,
×
10
0
Max.
4
C
2. Automatic mounting
To maintain the internal function of the
relay, the chucking pressure should
not exceed the values below.
Chucking pressure* in the direction A:
4.9 N {500 gf} or less
Chucking pressure* in the direction B:
9.8 N {1 kgf} or less
Chucking pressure* in the direction C:
9.8 N {1 kgf} or less
Please chuck the
Avoid chucking the center of the relay. In
addition, excessive chucking pressure to
the pinpoint of the relay should be avoid-
ed.
portion.
3. Soldering
Preheat according to the following condi-
tions.
Temperature
100°C
212°F
or less
Time
Within 1 minute
Soldering should be done at 250°C
482°F
within 5 s.
*Value of chucking pressure is shown by the value of weight
pressed on the portion (4 mm .157
inch dia.
).
For Cautions for Use, see Relay Technical Information (Page 48 to 76).
All Rights Reserved, Copyright Matsushita Electric Works, Ltd.
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