
PACKAGE INFORMATION
PE-SOT-23-5-0510
POWER DISSIPATION (SOT-23-5)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
(Power Dissipation (SOT-23-5) is substitution of SOT-23-6.)
Measurement Conditions
Standard Land Pattern
Environment
Mounting on Board (Wind velocity=0m/s)
Board Material
Glass cloth epoxy plactic (Double sided)
Board Dimensions
40mm
× 40mm × 1.6mm
Copper Ratio
Top side : Approx. 50% , Back side : Approx. 50%
Through-hole
φ0.5mm × 44pcs
Measurement Result
(Topt=25
°C,Tjmax=125°C)
Standard Land Pattern
Free Air
Power Dissipation
420mW
250mW
Thermal Resistance
θja=(12525°C)/0.42W=263°C/W
400
°C/W
0
50
100
25
75 85
125
150
Ambient Temperature (
°C)
0
200
100
300
400
250
420
500
600
Power
Dissipation
P
D
(mW)
On Board
Free Air
40
Power Dissipation
Measurement Board Pattern
IC Mount Area Unit : mm
RECOMMENDED LAND PATTERN
0.7 MAX.
0.95
1.9
2.4
1.0
(Unit: mm)