參數(shù)資料
型號: RM806
英文描述: RM806: PA Module for TDMA AMPS (824–849 MHz)|PA Modules for TDMA Handsets
中文描述: RM806:功率放大器模塊的TDMA安培(824-849兆赫)|功率放大器模塊的TDMA手機(jī)
文件頁數(shù): 1/16頁
文件大?。?/td> 764K
代理商: RM806
Data Sheet
2001, Skyworks Solutions, Inc., All Rights Reserved.
100602G
February 7, 2002
RM806
Power Amplifier Module for TDMA AMPS (824–849 MHz)
The dual-mode RM806 Power Amplifier (PA) is a fully matched, 6-pin, surface mount
module designed for Time Division Multiple Access (TDMA) and Advanced Mobile
Phone Service (AMPS) mobile units operating in the 824-849 MHz cellular bandwidth.
This device meets stringent IS-136 linearity requirements beyond 30 dBm output
power and can be driven to power output levels beyond 31 dBm for high efficiency FM
mode operation. A single GaAs (GaAs) Microwave Monolithic Integrated Circuit
(MMIC) contains all active circuitry in the module. The MMIC contains onboard bias
circuitry as well as input and interstage matching circuits. The output match is
realized off-chip within the module package to optimize efficiency and power
performance into a 50 ohm load. This device is manufactured using Skyworks’ GaAs
Heterojunction Bipolar Transistor (HBT) process, which provides for all positive
voltage DC supply operation while maintaining high efficiency and good linearity.
Primary bias to the RM806 can be supplied directly from a three-cell nickel cadmium,
a single-cell lithium-ion battery, or any other suitable battery with output in the
3 to 4 volts range. Power down is accomplished by setting the low current reference
pin to zero volts. No external supply side switch is needed as typical “off” leakage is a
few microamperes with full primary voltage supplied from the battery.
Functional Block Diagram
MMIC
MODULE
RFIN
(2)
RFOUT
(5)
VCC1
(1)
GND
GND
VCC2
(4)
VREF
(3)
Driver
Stage Bias
Power
Stage Bias
DA
Inter
Stage
Match
PA
Output
Match
(6, 7)
(6, 7)
Input
Match
Distinguishing Features
Low voltage positive bias supply
Good linearity
High efficiency
Dual mode operation
Large dynamic range
6-pin package
(6 mm x 6mm x 1.5 mm)
Power down control
Applications
Digital cellular (TDMA)
Analog cellular (AMPS)
Wireless local loop (WLL)
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