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參數(shù)資料
| 型號： | RM008 |
| 廠商： | SKYWORKS SOLUTIONS INC |
| 元件分類： | 放大器 |
| 英文描述： | PA Module for Dual-band GSM900 and DCS1800 Applications |
| 中文描述： | 880 MHz - 915 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 9.10 X 11.61 MM, 1.64 MM HEIGHT, SO-16 |
| 文件頁數(shù)： | 10/12頁 |
| 文件大?。?/td> | 513K |
| 代理商： | RM008 |
RM008
Package and Handling Information
PA Module for Dual-band GSM900 and DCS1800 Applications
100781D
Skyworks Solutions, Inc. Proprietary
7
July 26, 2002
Package and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum packed
prior to shipment. Instructions on the shipping container label must be followed regarding exposure
to moisture after the container seal is broken, otherwise, problems related to moisture absorption
may occur when the part is subjected to high temperature during solder assembly.
The RM008 is capable of withstanding an MSL 3/240 °C solder reflow. Care must be taken when
attaching this product, whether it is done manually or in a production solder reflow environment. If
the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 °C per second;
maximum temperature should not exceed 240 °C. If the part is manually attached, precaution
should be taken to insure that the part is not subjected to temperatures exceeding 240 °C for more
than 10 seconds.
For details on both attachment techniques, precautions, and handling procedures recommended by
Skyworks, please refer to Application Note: PCB Design and SMT Assembly/Rework, Document
Number 101752. Additional information on standard SMT reflow profiles can also be found in the
JEDEC Standard J–STD–020A.
Figure 4. Typical Case Markings
100781_006
RM008-NN
NXXXXX.XX
YYWW MEX
Manufacturing Part Number–Revision Number
Lot Number
YY = Manufacture Year
WW = Week Package Sealed
MEX = Country Code
Mark Pin 1
Identifier
SKYWORKS
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