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參數(shù)資料
| 型號： | RLS632-151MT |
| 廠商： | ADVANCED INTERCONNECTIONS CORP |
| 元件分類： | 插座 |
| 英文描述： | DIP32, IC SOCKET |
| 文件頁數(shù)： | 2/2頁 |
| 文件大?。?/td> | 176K |
| 代理商： | RLS632-151MT |
Molded DIP Sockets
Closed Frame and Open Frame
DIP Sockets
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Cat. 16 Rev. 1
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
22
.400
(10.16)
.500
(12.70)
1.100
(27.54)
24
.400
(10.16)
.500
(12.70)
1.200
(30.48)
24
.600
(15.24)
.700
(17.78)
1.200
(30.48)
28
.600
(15.24)
.700
(17.78)
1.400
(35.56)
32
.600
(15.24)
.700
(17.78)
1.600
(40.64)
40
.600
(15.24)
.700
(17.78)
2.000
(50.80)
48*
.600
(15.24)
.700
(17.78)
2.400
(60.96)
64*
.900
(22.86)
1.000
(25.40)
3.200
(81.28)
8
.300
(7.62)
.400
(10.16)
.400
(10.16)
14
.300
(7.62)
.400
(10.16)
.700
(17.78)
16
.300
(7.62)
.400
(10.16)
.800
(20.32)
18
.300
(7.62)
.400
(10.16)
.900
(22.86)
20
.300
(7.62)
.400
(10.16)
1.000
(25.40)
22
.300
(7.62)
.400
(10.16)
1.100
(27.94)
24
.300
(7.62)
.400
(10.16)
1.200
(30.48)
28
.300
(7.62)
.400
(10.16)
1.400
(35.56)
.165
(4.19)
.275
(6.99)
.020 Dia.
(.51)
Standard Quick-Turn Terminals
Type -01
Type -29
Type -30
Type -51
Low Profile Solder Tail
.165
(4.19)
.125
(3.18)
.020 Dia.
(.51)
.165
(4.19)
.170
(4.32)
.020 Dia.
(.51)
.130
(3.30)
.110
(2.79)
.020 Dia.
(.51)
Low Profile Solder Tail
Type -04
Type -49
.120
(3.05)
.110
(2.79)
.028 Dia.
(.71)
.095
(2.41)
.095
(2.41)
.028 Dia.
(.71)
Solder Preform Terminals
.072 Dia.
(1.83)
.020 Dia.
(.51)
.110
(2.79)
.130
(3.30)
Solder
Preform
.072 Dia.
(1.83)
.165
(4.19)
.125
(3.18)
.020 Dia.
(.51)
Solder
Preform
Tin/Lead: Type -150
Tin/Lead: Type -151
Lead-free: Type -811
Lead-free: Type -812
Type -237
.052 Dia.
(1.32)
.155
(3.94)
Dimensional Information
B
C
A
.125
(3.18)
C
A
.050*
(1.27)
B
Closed Frame
Open Frame
# of Pins
A
B
C
Intrusive Reflow Application:
Combines the labor of socket
loading and solder application into
one operation.
Eliminates the use of solder paste
and screening operation.
Eliminates solder bridges and/or
solder shorts due to excess
solder.
Ensures a reliable solder joint with
controlled solder volume.
Ideal for surface mount and mixed
technology applications.
For custom solder preform
terminal applications consult
factory.
# of Pins
A
B
C
The dimensions in blue are for Open Frame only.
*Socket body thickness is .100/(2.54) for 48 and 64 positions.
Ultra Low Profile
Not for use with Closed Frame
Super Low Profile
Not for use with Closed Frame
Surface Mount
Additional standard and custom terminals available.
See Terminals section online or consult factory.
Available Online:
RoHS Qualification Test Report
PC Board
Preform After
Solder Flow
Solder Preform
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