參數(shù)資料
型號(hào): RH80530NZ004256
英文描述: MICROPROCESSOR|32-BIT|CMOS|PGA|478PIN|CERAMIC
中文描述: 微處理器| 32位|的CMOS |美巡賽| 478PIN |陶瓷
文件頁(yè)數(shù): 3/89頁(yè)
文件大?。?/td> 1672K
代理商: RH80530NZ004256
Mobile Intel
Pentium
III Processor-M Datasheet
298340-002
Datasheet
3
Contents
1.
Introduction.....................................................................................................................................10
1.1
Overview...............................................................................................................11
1.2
State of the Data ..................................................................................................11
1.3
Terminology..........................................................................................................12
1.4
References...........................................................................................................12
Mobile Intel Pentium III Processor-M Features..............................................................................13
2.1
New Features in the Mobile Pentium III Processor-M..........................................13
2.1.1
133-MHz PSB With AGTL Signaling.......................................................13
2.1.2
512K On-die Integrated L2 Cache ..........................................................13
2.1.3
Data Prefetch Logic.................................................................................13
2.1.4
Differential Clocking ................................................................................13
2.1.5
Deeper Sleep State.................................................................................13
2.1.6
Signal Differences Between the Mobile Pentium III Processor (in BGA2
and Micro-PGA2 Packages) and the Mobile Intel Pentium III
Processor-M............................................................................................14
2.2
Power Management.............................................................................................14
2.2.1
Clock Control Architecture.......................................................................14
2.2.2
Normal State ...........................................................................................14
2.2.3
Auto Halt State ........................................................................................14
2.2.4
Quick Start State .....................................................................................15
2.2.5
HALT/Grant Snoop State ........................................................................16
2.2.6
Deep Sleep State ....................................................................................16
2.2.7
Deeper Sleep State.................................................................................16
2.2.8
Operating System Implications of Low-power States .............................17
2.2.9
Enhanced Intel SpeedStep Technology..................................................17
2.3
AGTL Signals .......................................................................................................17
2.4
Mobile Intel Pentium III Processor-M CPUID.......................................................18
Electrical Specifications..................................................................................................................19
3.1
Processor System Signals ...................................................................................19
3.1.1
Power Sequencing Requirements...........................................................20
3.1.2
Test Access Port (TAP) Connection .......................................................21
3.1.3
Catastrophic Thermal Protection.............................................................21
3.1.4
Unused Signals .......................................................................................21
3.1.5
Signal State in Low-power States ...........................................................21
3.2
Power Supply Requirements................................................................................22
3.2.1
Decoupling Guidelines ............................................................................22
3.2.2
Voltage Planes ........................................................................................23
3.2.3
Voltage Identification...............................................................................23
3.3
System Bus Clock and Processor Clocking.........................................................24
3.4
Enhanced Intel SpeedStep Technology...............................................................24
3.5
Maximum Ratings.................................................................................................25
3.6
DC Specifications.................................................................................................25
2.
3.
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