參數(shù)資料
型號: RF5176PCBA
廠商: RF Micro Devices, Inc.
元件分類: 基準電壓源/電流源
英文描述: 3V W-CDMA POWER 1900MHZ/ 3V LINEAR POWER AMPLIFIER
中文描述: 3V的的W - CDMA功率1900MHZ / 3V的線性功率放大器
文件頁數(shù): 3/6頁
文件大?。?/td> 169K
代理商: RF5176PCBA
Preliminary
2-199
RF5176
Rev A0 010910
2
P
Pin
1
Function
VREG1
Description
Bias control for the first stage. Needs to be divided down from its nomi-
nal value of 2.5V using a resistive divider network of 240k
and
360k
. V
REG1
and V
REG2
may be adjusted to minimize idle current for
a given output power. Alternative V
REG
voltages can be used as
defined on the application schematic.
Supply for bias circuits.
Interface Schematic
2
3
VCC BIAS
VREG2
Bias control for the second stage. Needs to be divided down from its
nominal value of 2.5V using a resistive divider network of 240k
and
240k
. Alternative V
REG
voltages can be used as defined on the appli-
cation schematic.
Second stage bias circuit source. For best linearity, decouple with
bypassing capacitors of 15pF and 100nF.
Connect to ground plane via a 15nH inductor. DC return for the second
stage bias circuit.
Not currently used.
4
VS2
5
BIAS GND
6
7
8
NC
NC
Not currently used.
RF OUT
RF output and power supply for the final stage. This is the unmatched
collector of the final stage. It requires an output matching network,
including a DC blocking capacitor.
Same as pin 8.
9
RF OUT
RF OUT
NC
VCC1
10
11
12
Same as pin 8.
Not currently used.
Power supply for the first stage and interstage match. Requires a shunt
capacitor of 12pF close to the pin for optimum match.
Same as pin 12.
13
14
15
16
VCC1
NC
NC
RF IN
Not currently used.
Not currently used.
RF input. Requires a blocking capacitor and shunt inductor to provide
2:1 VSWR.
Not currently used.
17
18
NC
Q1B
Base bias for first stage. For best linearity, decouple with 15pF and
100nF capacitors.
Not currently used.
19
20
Pkg
Base
NC
NC
GND
Not currently used.
Ground connection. The backside of the package should be soldered
to a top side ground pad which is connected to the ground plane with
multiple vias. The pad should have a short thermal path to the ground
plane.
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