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參數(shù)資料
| 型號： | RF3164 |
| 廠商： | RF MICRO DEVICES INC |
| 元件分類： | 衰減器 |
| 英文描述： | 3V 1900MHz LINEAR POWER AMPLIFIER MODULE |
| 中文描述： | 1850 MHz - 1910 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER |
| 封裝： | ROHS COMPLIANT, 3 X 3 MM, QFN-16 |
| 文件頁數(shù)： | 8/10頁 |
| 文件大?。?/td> | 98K |
| 代理商： | RF3164 |
2-8
RF3164
Rev A2 050112
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is
3
μ
inch to 8
μ
inch gold over 180
μ
inch nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and
tested for optimized assembly at RFMD; however, it may require some modifications to address company specific
assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Pattern
A = 0.64 x 0.28 (mm) Typ.
B = 0.28 x 0.64 (mm) Typ.
C = 0.78 x 0.64 (mm)
D = 0.64 x 1.28 (mm)
E = 1.50 (mm) Sq.
Dimensions in mm.
Pin 1
Pin 8
Pin 16
E
A
A
A
A
B
B
B
B
A
D
B
B
C
1.50 Typ.
0.50 Typ.
0.55 Typ.
0.75 Typ.
0.55 Typ.
0.75 Typ.
0.75
Typ.
1.00 Typ.
Figure 1. PCB Metal Land Pattern (Top View)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| RF3164_06 | 制造商:RFMD 制造商全稱:RF Micro Devices 功能描述:3V 1900MHz LINEAR POWER AMPLIFIER MODULE |
| RF3164_1 | 制造商:RFMD 制造商全稱:RF Micro Devices 功能描述:3V 1900MHz LINEAR POWER AMPLIFIER MODULE |
| RF-3164-AT122 | 制造商:HARRIS 制造商全稱:HARRIS 功能描述:Manpack high band Antenna 225 to 450 MHz |
| RF3164PCBA-41X | 制造商:RFMD 制造商全稱:RF Micro Devices 功能描述:3V 1900MHz LINEAR POWER AMPLIFIER MODULE |
| RF3165 | 制造商:RFMD 制造商全稱:RF Micro Devices 功能描述:3V 1750MHZ W-CDMA LINEAR POWER AMPLIFIER MODULE |
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