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參數(shù)資料
| 型號(hào)： | RF3146SB |
| 廠商： | RF MICRO DEVICES INC |
| 元件分類： | 衰減器 |
| 英文描述： | QUAD-BAND GSM850/GSM900/DCS/PCS POWER AMP MODULE |
| 中文描述： | 824 MHz - 849 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 7 X 7 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, LFM-48 |
| 文件頁數(shù)： | 17/18頁 |
| 文件大?。?/td> | 317K |
| 代理商： | RF3146SB |
Preliminary
2-507
RF3146
Rev A7 040812 W3
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the
PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all
pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask
clearance can be provided in the master data or requested from the PCB fabrication supplier.
Thermal Pad and Via Design
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been
designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating
routing strategies.
The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size
on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested
that the quantity of vias be increased by a 4:1 ratio to achieve similar results.
Dimensions in mm.
Pin 36
Pin 24
Pin 48
Pin 1
0.55 Typ.
2.75
0.50 Typ.
0.55 Typ.
5.50 Typ.
0.50 Typ.
5.50 Typ.
1.95
A = 0.74 x 0.38 (mm) Typ.
B = 0.38 x 0.74 (mm) Typ.
C = 5.25 x 2.20 (mm)
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
C
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
Figure 2. PCB Solder Mask Pattern (Top View)
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