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參數(shù)資料
| 型號： | RF2890 |
| 廠商： | RF MICRO DEVICES INC |
| 元件分類： | 衰減器 |
| 英文描述： | DUAL-BAND CDMA CELLULAR/GPS LOW NOISE AMPLIFIER/MIXER |
| 中文描述： | 800 MHz - 900 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | 4 X 4 MM, ROHS COMPLIANT, PLASTIC, QFN-24 |
| 文件頁數(shù)： | 13/14頁 |
| 文件大小： | 183K |
| 代理商： | RF2890 |
8-421
RF2890
Rev A4 040421
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is
3
μ
inch to 8
μ
inch gold over 180
μ
inch nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and
tested for optimized assembly at RFMD; however, it may require some modifications to address company specific
assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Pattern
A = 0.64 x 0.28 (mm) Typ.
B = 0.28 x 0.64 (mm) Typ.
C = 2.50 (mm) Sq.
Pin 1
Pin 18
Pin 12
Pin 24
Dimensions in mm.
A
A
A
A
A
A
B
B
B
B
B
B
A
A
A
A
A
A
B
B
B
B
B
B
C
2.50 Typ.
0.50 Typ.
0.50 Typ.
0.55 Typ.
0.55 Typ.
2.50 Typ.
1.25
1.25
Figure 1. PCB Metal Land Pattern (Top View)
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