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參數(shù)資料
| 型號(hào)： | RF2870PCBA |
| 廠商： | RF Micro Devices, Inc. |
| 英文描述： | CDMA LOW NOISE AMPLIFIER/MIXER 900MHz DOWNCONVERTER |
| 中文描述： | CDMA的低噪聲放大器/混頻器900MHz的下變頻器 |
| 文件頁(yè)數(shù)： | 13/14頁(yè) |
| 文件大?。?/td> | 400K |
| 代理商： | RF2870PCBA |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)當(dāng)前第13頁(yè)第14頁(yè)
8-13
RF2870
Rev A8 030507
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is Electroless Nickel, immersion Gold. Typical thickness is
3
μ
inch to 8
μ
inch Gold over 180
μ
inch Nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and
tested for optimized assembly at RFMD; however, it may require some modifications to address company specific
assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Pattern
0.50 (mm) Typ.
1.50 (mm)
Typ.
0.50 (mm) Typ.
Pin 16
A
A
A
A
C
B
B
B
B
A
A
A
A
B
B
B
B
A = 0.28 x 0.69 (mm) Typ.
B = 0.69 x 0.28 (mm) Typ.
C = 1.60 (mm) Sq.
Pin 1
Pin 8
Pin 12
0.60 (mm) Typ.
0.60 (mm) Typ.
0.75 (mm) Typ.
1.50 (mm)
Typ.
0.75 (mm)
Typ.
Figure 1. PCB Metal Land Pattern (Top View)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| RF2872-000 | 制造商:TE Connectivity 功能描述:GDT - Trays |
| RF2873-000 | 功能描述:POLYSWITCH 1.25A RESET FUSE RAD RoHS:是 類別:過(guò)電壓，電流，溫度裝置 >> PTC 可復(fù)位保險(xiǎn)絲 系列:LVB125 標(biāo)準(zhǔn)包裝:500 系列:PFRA 電流 - 維持(Ih):750mA 電流 - 跳閘(It):1.5A 電流 - 最大:40A 電壓 - 最大:60V R最小/最大:0.180 ~ 0.400 歐姆 跳閘時(shí)間:6.3s 封裝/外殼:徑向 - 圓盤形 包裝:散裝 |
| RF2877-000 | 制造商:TE Connectivity 功能描述:GDT - Trays |
| RF2878 | 制造商:RFMD 制造商全稱:RF Micro Devices 功能描述:3V LOW NOISE AMPLIFIER/ 3V PA DRIVER AMPLIFIER |
| RF2878_1 | 制造商:RFMD 制造商全稱:RF Micro Devices 功能描述:3V LOW NOISE AMPLIFIER/ 3V PA DRIVER AMPLIFIER |
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