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參數(shù)資料
| 型號(hào)： | RF2681 |
| 廠商： | RF MICRO DEVICES INC |
| 元件分類： | 衰減器 |
| 英文描述： | W-CDMA LINEAR VARIABLE GAIN DRIVER AMPLIFIER |
| 中文描述： | 1920 MHz - 1980 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER |
| 封裝： | 3 X 3 MM, QFN, LCC-12 |
| 文件頁(yè)數(shù)： | 3/8頁(yè) |
| 文件大?。?/td> | 157K |
| 代理商： | RF2681 |
Preliminary
4-45
RF2681
Rev A1 010824
4
G
A
Pin
1
Function
VCC1
Description
DC supply for internal bias circuitry. This pin should be tied to VCC, and
must be bypassed with an RF capacitor. The trace length between the
pin and the bypass capacitor should be minimized. The ground side of
the capacitor should connect immediately to the ground plane.
DC supply for internal bias circuitry. This pin should be tied to a 2.7V
supply for proper operation. Increasing this voltage above 2.7V will
result in increased current drain and is not recommended.
Same as pin 1.
Interface Schematic
2
VREG
3
4
VCC2
PD
Power down pin. This pin should be brought below 1V for proper opera-
tion. The device is turned off when the voltage on this pin increases
above 2V.
This pin is not internally connected, but should be grounded, if possi-
ble, to improve RF isolation. Please refer to the evaluation board layout.
RF input pin. This pin requires external matching components, and is
DC-coupled. Please refer to the applications schematic for recom-
mended matching components.
Ground
5
NC
6
RF IN
7
8
9
GND
GND
GND
RF OUT
Ground
Ground
10
RF output pin. This pin requires an external matching network. VCC is
provided through an inductor of that network. Please refer to the appli-
cations schematic for recommended matching components.
Same as pin 5.
11
12
NC
GC
Gain control pin. This pin allows the gain of the amplifier to be varied in
a continuous “analog” fashion. With an applied voltage of 0.2V or less,
the amplifier exhibits the minimum gain. In the region between 0.2V
and 2.25V, the amplifier gain in dB depends on the voltage in a roughly
linear manner. Above 2.25V, the amplifier gain is set for maximum.
Ground connection for the device “die flag”. The backside of the pack-
age should be soldered to a top side ground pad which is connected to
the PC board ground plane through multiple vias.
Pkg
Gnd
GND
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