參數(shù)資料
型號(hào): RF2192PCBA
廠商: RF Micro Devices, Inc.
元件分類: 基準(zhǔn)電壓源/電流源
英文描述: 3V 900MHZ LINEAR POWER AMPLIFIER
中文描述: 3V的900MHz的線性功率放大器
文件頁(yè)數(shù): 5/8頁(yè)
文件大?。?/td> 131K
代理商: RF2192PCBA
Preliminary
2-207
RF2192
Rev A1 010830
2
P
Pin
1
2
3
4
Function
GND
GND
GND
RF IN
Description
Ground connection.
Interface Schematic
Ground connection.
Ground connection.
RF input. An external 100pF series capacitor is required as a DC block.
In addition, shunt inductor and series capacitor are required to provide
2:1VSWR.
5
VREG1
Power Down control for first stage. Regulated voltage supply for ampli-
fier bias. In Power Down mode, both V
REG
and V
MODE
need to be LOW
(<0.5V).
For nominal operation (High Power Mode), V
MODE
is set LOW. When
set HIGH, the driver and final stage are dynamically scaled to reduce
the device size and as a result to reduce the idle current.
Power Down control for the second stage. Regulated voltage supply for
amplifier bias. In Power Down mode, both V
REG
and V
MODE
need to be
LOW (<0.5V).
Bias circuitry ground. See application schematic.
6
VMODE
7
VREG2
8
9
BIAS GND
GND
RF OUT
Ground connection.
10
RF output and power supply for final stage. This is the unmatched col-
lector output of the second stage. A DC block is required following the
matching components. The biasing may be provided via a parallel L-C
set for resonance at the operating frequency of 824MHz to 849MHz. It
is important to select an inductor with very low DC resistance with a 1A
current rating. Alternatively, shunt microstrip techniques are also appli-
cable and provide very low DC resistance. Low frequency bypassing is
required for stability.
Same as pin 10.
11
12
13
RF OUT
RF OUT
2FO
See pin 10.
Same as pin 10.
Harmonic trap. This pin connects to the RF output but is used for pro-
viding a low impedance to the second harmonic of the operating fre-
quency. An inductor or transmission line resonating with an on chip
capacitor at 2fo is required at this pin.
Power supply for bias circuitry. A 100pF high frequency bypass capaci-
tor is recommended.
Power supply for first stage.
14
VCC BIAS
15
16
Pkg
Base
VCC1
VCC1
GND
Same as Pin 15.
Ground connection. The backside of the package should be soldered to
a top side ground pad which is connected to the ground plane with mul-
tiple vias. The pad should have a short thermal path to the ground
plane.
GND1
RF IN
VCC1
From
Bias
Stages
100 pF
RF OUT
From Bias
Stages
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