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參數(shù)資料
| 型號(hào)： | RF2172PCBA-L |
| 廠商： | RF Micro Devices, Inc. |
| 英文描述： | ISM BAND 3.6V, 250MW AMP WITH ANALOG GAIN CONTROL |
| 中文描述： | ISM頻段3.6V的，25萬(wàn)千瓦，與模擬增益控制放大器 |
| 文件頁(yè)數(shù)： | 3/12頁(yè) |
| 文件大?。?/td> | 292K |
| 代理商： | RF2172PCBA-L |
2-215
RF2172
Rev A9 010823
2
P
Pin
1
Function
GND
Description
Ground connection. For best performance, keep traces physically short
and connect immediately to the ground plane.
Ground connection for the driver stage. For best performance, keep
traces physically short and connect immediately to the ground plane.
RF input. This is a 50
input. No external matching is needed. An
external DC blocking capacitor is required if this port is connected to a
DC path to ground or a DC voltage.
See pin 1.
Interface Schematic
2
GND
3
RF IN
See pin 15.
4
5
6
GND
GND
VPD
See pin 1.
Power down pin. When this pin is 0V, the device will be in power down
mode, dissipating minimum DC power. This pin also serves as the V
CC
supply pin for the bias circuitry. V
PD
should be at the supply voltage
when the part is not in power down mode.
Analog power control. Output power varies as a function of the voltage
on this pin. See graph. This pin must be driven through a series resistor
with a voltage between 0V and V
CC
. Series resistor determines
dynamic range of power control. See plot “P
OUT
versus Gain Control
versus Gain Control Resistor”.
7
APC
8
9
GND
GND
GND
RF OUT
See pin 1.
See pin 1.
10
11
See pin 1.
RF output. An external matching network is required to provide the opti-
mum load impedance at this pin.
RF output and power supply for the output stage. Bias voltage for the
output stage is provided through this pin. A shunt cap resonating with
the bond wire inductance at 2xf
0
can also be used at this pin to provide
a second harmonic trap.
See pin 1.
See pin 15.
12
RF OUT
See pin 15.
13
14
15
GND
GND
VCC
See pin 1.
Power supply for driver stage and interstage matching. This pin forms
the shunt inductance needed for proper tuning of the interstage. Refer
to the application schematic for the proper configuration. Note: Position
and value of the components are important.
16
Pkg
Base
GND
GND
See pin 1.
Ground connection for the output stage. This pad should be connected
to the groundplane by vias directly under the device. A short path is
required to obtain optimum performance, as well as provide a good
thermal path to the PCB for maximum heat dissipation.
APC
Bias
Network
RF IN
1st
Stage
GND
External Cap
V
CC
Inductor
Bond
Wire
Pin 15
RF OUT
1st Stage
2nd Stage
RF IN
RF OUT
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