參數(shù)資料
型號: REG1117TR
英文描述: Positive Adjustable Voltage Regulator
中文描述: 積極可調(diào)電壓穩(wěn)壓器
文件頁數(shù): 7/12頁
文件大?。?/td> 382K
代理商: REG1117TR
REG1117, REG1117A
SBVS001B
7
www.ti.com
THERMAL CONSIDERATIONS
The REG1117 has current limit and thermal shutdown
circuits that protect it from overload. The thermal shutdown
activates at approximately T
J
= 165
°
C. For continuous op-
eration, however, the junction temperature should not be
allowed to exceed 125
°
C. Any tendency to activate the
thermal shutdown in normal use is an indication of an
inadequate heat sink or excessive power dissipation. The
power dissipation is equal to:
P
D
= (V
IN
– V
OUT
) I
OUT
The junction temperature can be calculated by:
T
J
= T
A
+ P
D
(
θ
JA
)
where T
A
is the ambient temperature, and
θ
JA
is the junction-to-ambient thermal resistance
A simple experiment will determine whether the maximum
recommended junction temperature is exceeded in an actual
circuit board and mounting configuration: Increase the am-
bient temperature above that expected in normal operation
until the device’s thermal shutdown is activated. If this
occurs at more than 40
°
C above the maximum expected
ambient temperature, then the T
J
will be less than 125
°
C
during normal operation.
The internal protection circuitry of the REG1117 was de-
signed to protect against overload conditions. It was not
intended to replace proper heat sinking. Continuously run-
ning the REG1117 into thermal shutdown will degrade
reliability.
LAYOUT CONSIDERATIONS
The DDPAK (REG1117F-3.3 and REG1117FA) is a sur-
face-mount power package that has excellent thermal char-
acteristics. For best thermal performance, its mounting tab
should be soldered directly to a circuit board copper area, as
shown in Figure 3. Increasing the copper area improves heat
dissipation. Figure 4 shows typical thermal resistance from
junction-to-ambient as a function of the copper area.
FIGURE 3. DDPAK Thermal Resistance versus Circuit Board Copper Area.
FIGURE 4. DDPAK Thermal Resistance versus Circuit Board Copper Area.
3-Lead DDPAK
(1)
NOTE: (1) For improved thermal performance increase
footprint area. See Figure 4,
Thermal Resistance vs
Circuit Board Copper Area
.
All measurements
in inches.
0
0
0
0.51
0.10
0.155
0.05
Circuit Board Copper Area
REG1117F
DDPAK Surface-Mount Package
THERMAL RESISTANCE vs
CIRCUIT BOARD COPPER AREA
60
50
40
30
20
10
T
J
°
C
0
1
2
3
4
5
Copper Area (inches
2
)
REG1117F
DDPAK Surface Mount Package
1oz copper
θ
相關(guān)PDF資料
PDF描述
REG1117A-5 800mA and 1A Low Dropout (LDO) Positive Regulator 1.8V. 2.5V. 2.85V. 3.3V. 5V. and Adj
REG1117A-TR Positive Adjustable Voltage Regulator
REG1117AG4 800mA and 1A Low Dropout Positive Regulator 1.8V, 2.5V, 2.85, 3.3V, 5V, and Adjustable
REG1117F33KTTTG3 800mA and 1A Low Dropout Positive Regulator 1.8V, 2.5V, 2.85, 3.3V, 5V, and Adjustable
REG1117FA1.8KTTTG3 800mA and 1A Low Dropout Positive Regulator 1.8V, 2.5V, 2.85, 3.3V, 5V, and Adjustable
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
REG1118 制造商:BB 制造商全稱:BB 功能描述:800mA Low Dropout Positive Regulator with Current Source and Sink Capability
REG1118-2.85 功能描述:低壓差穩(wěn)壓器 - LDO 800mA Low Dropout RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓(最大值):307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20
REG1118-2.85/2K5 功能描述:低壓差穩(wěn)壓器 - LDO 800mA Low Dropout RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓(最大值):307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20
REG1118-2.85/2K5G4 功能描述:低壓差穩(wěn)壓器 - LDO 800mA Low Dropout RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓(最大值):307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20
REG1118-2.85G4 功能描述:低壓差穩(wěn)壓器 - LDO 800mA Low Dropout RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓(最大值):307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20