
BCD.00017 Rev. AA, 18-Oct-2010
Page 16 of 18
www.power-one.com
RFS/RDS Series Data Sheet
20W SMT DC-DC Converters, 1.5 – 5VOutput
Mechanical Data
Dimensions in mm [inches]
JM066
Highest component
≤ 3.1 [0.122]
Tc & pick up point
Pin 1
Tc & pick up point
≤
9.45
[0.372]
(RFS)
≤
8.3
[0.327]
(RDS)
Surface Mount Assembly
Soldering
The following soldering instructions must be observed
to prevent failure or significant degradation of the
converter performance. Power-One will not honor any
warranty claims arising from failure to observe these
instructions.
The lead-frame is constructed for a high temperature
glass filled, UL94 V-0 flame retardant, dually ortho-
phthalate molding compound commonly used for
packaging of electronics components. It has passed
NASA outgassing tests, and is certified to MIL-M-14.
The coefficient of thermal expansion is equivalent to
FR4.
The gull wing leads are formed to ensure optimal
solder joint strength and structure. Furthermore they
facilitate visual inspection (manual or automatic). The
leads are formed from a 97% Cu alloy plated with Ni
and matte Sn. This material is commonly used in
the manufacture of integrated circuits. It has good
corrosion resistance and exhibits the nobility inherent
to all high copper alloys. Unlike brasses, this material
is essentially immune to stress corrosion cracking. It
also exhibits excellent solderability. It is readily wetted
by solders and performs well in standard solderability
tests. (Dip of Class II or better).
The product is manufactured with a patented process,
which is fully automated and ‘in-line’. This ensures
that there is no contamination or mechanical stress on
the
lead-frame
so
that
the
co-planarity
and
solderability are maintained.
The product is shipped in JEDEC trays to ensure
preservation of the co-planarity and enable fully
automated assembly in the final application. Mind the
marking for pin 1!
These products are approved for forced convection
reflow soldering only. Products RoHS-compliant for all
6 substances (model designation ending with G) allow
for a solder profile with higher temperatures; see
tables below.