參數(shù)資料
型號: RD28F3208C3T70
廠商: INTEL CORP
元件分類: 存儲器
英文描述: 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA66
封裝: 8 X 10 MM, 1.20 MM HEIGHT, SCSP-66
文件頁數(shù): 40/70頁
文件大?。?/td> 1223K
代理商: RD28F3208C3T70
3VoltIntel
Advanced+BootBlockFlashMemoryStacked-CSPFamily
40
Datasheet
6.0
MigrationGuideInformation
Typically,itisimportanttodiscussfootprintmigrationcompatibilitybetweenanewproductand
existingproducts.Inthisspecificcase,theStacked-CSPallowsthesystemdesignertoremovetwo
separatememoryfootprintsforindividualflashandSRAMandreplacethemwithasingle
footprint,thusresultinginanoverallreductioninboardspacerequired.Thisimpliesthatanew
printedcircuitboardwouldbeusedtotakeadvantageofthisfeature.
SincetheflashinStacked-CSPsharesthesamefeaturesastheAdvanced+BootBlockFeatures,
conversionsfromtheAdvancedBootBlockaredescribedin
AP-658DesigningforUpgradetothe
Advanced+BootBlockFlashMemory,
ordernumber292216
.
PleasecontactyourlocalIntelrepresentationfordetailedinformationaboutspecificFlash+
SRAMsystemmigrations.
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